Reliability Research Of GaN Power Chips For Aerospace Application

Gallium nitride(GaN)is known as the third generation semiconductor material,and its chips are widely used in aerospace,military and other fields.Compared with the near-Earth space environment of human life,the space environment is very harsh.NV6117 power chip Tianwen II detector payload charged particles and neutral particle analyzer stand-alone components,the need for high reliability and quality assurance.Therefore,this paper mainly studies the reliability of NV6117 power chip from four aspects : electrical parameter test,double pulse test simulation model,application circuit verification,reliability test and evaluation.Firstly,the drain drop time,drain to source leakage current and on-resistance are selected as the parameters to characterize the working performance of NV6117 power supply chip.According to the test principle of different parameters,the corresponding circuit test board is designed,and the parameter test system is built to realize the test of test parameters.The double pulse test simulation model of NV6117 power chip is built by using the simulation software LTspice,and the on and off parameters in the test process are analyzed,which provides a reasonable theoretical reference for the application circuit design and reliability evaluation of NV6117 gallium nitride power chip.The boost circuit is designed by using DCDC control chip LM5022 combined with NV6117 power supply chip,and the performance of the power supply chip is verified in the actual circuit.Through the appearance inspection and ultrasonic detection test of NV6117 power supply chip,the device is preliminarily screened.the aging circuit board was designed,and the aging test was carried out by using the integrated circuit aging system BIT-3000 AT.The degradation data were obtained by the long-term aging test of NV6117.Finally,the electrical parameter test circuit is used to test the parameters before and after aging,and the appropriate data analysis method is selected to fit the parameters with obvious degradation phenomenon,and then the reliability level of the product is quantitatively evaluated.