Research On 3D Integration Technology Of E-band Phased Array T/R Component

Phased array antenna technology is an important part of modern communication technology.As its core component,the performance of transceiver module directly affects the index of the whole system.How to achieve high intensity and low loss of transceiver module is the current main research direction.In this paper,the integrated design of E-band phased array active transceiver module and antenna is realized based on 3D integrated advanced packaging technology.The design meets the needs of wide band,low loss and miniaturization.Firstly,the achievements and key technologies of 3D integrated modules are investigated,including etching,RDL,TSV,BGA and wafer bonding.According to the comparison of technical implementation methods,some schemes and material selections in the design of this paper are carried out.Then,the system and its cascading relationship are analyzed in detail from the aspects of single-channel link and chip function.The indexes of the key interconnection structure are evaluated and budgeted through link calculation,and the 3D integrated scheme design of the system is completed.Secondly,the design of key vertical interconnection structures proposed in the scheme and the tolerance analysis are carried out.(1)Combined with RDL and etching technology,a silicon embedded chip package structure is proposed,with the characteristics of non-bonding wire,broadband and low loss.The ports are vertically elicited through holes in the media layer.(2)A BGA vertical interconnection structure is designed for the integration of module and antenna.The structure achieves broadband transmission performance with low loss by impedance matching with high impedance line and coaxial-like structure.(3)Based on TSV and BGA technology,A vertical interconnection structure of multilayer bonded substrate is designed.The addition of matching pads achieves well interlayer impedance matching and improves the reliability of the design.Finally,the stack structure and chip layout of the E-band phased array transceiver module are designed,and the design and optimization are carried out for the bending and crossing of the transmission line.In addition,the transmission and isolation performance of the multi-port interconnect structure under the compact layout is verified.Then,the layout of the module and ports is completed,and the 3D model of the antenna integrated system is built.The design in this paper solves the problems of high transmission line layout density and signal line crossing in multi-channel phased array transceiver modules,and provides an effective solution for the integrated design of transceiver module and antenna.