Design Of Novel Epoxy Resins Contained Naphthyl Or Biphenyl Structures And The Research Of The Properties Of The Composites

Epoxy resin is widely used in the field of electronics and electricity because of its excellent electrical insulation,low cost and good processing properties.With the miniaturization of electronic components,electronic packaging materials are required not only to have good insulation performance,but also higher thermal conductivity.The improvement of thermal conductivity,heat resistance,insulation,hydrophilic and hydrophobic properties of electronic packaging materials has also be studied by many scientific researches.This paper is about improving the properties of electronic packaging materials,focused on the molecular design and synthesis of epoxy resin.Through the introduction of naphthalene,biphenyl and fluorocarbon bond,the epoxy resin curing systems show high heat resistance,strong hydrophobicity and good electrical insulating performance.After that,the structure,performance and curing reaction process of these samples were studied in detail:1.A naphthyl epoxy resin containing fluorine was synthesized by nucleophilic addition reaction.The curing kinetics and curing mechanism of this product with aromatic amine,methylhexahydrophthalic anhydride and dimethylimidazole were studied by DSC and the effects of fluorocarbon bond on its water-absorbing and dielectric properties were studied.2.The p-methylphenyl type epoxy resin(p-MEP)was synthesized by using it as raw material.Then,the heat conducting filler/p-methylphenyl epoxy resin composite was prepared by adding spherical aluminum oxide,hexagonal boron nitride and powdered aluminum nitride.The relationship between fluidity,thermal conductivity and polymer structure was studied.3.A pair of 4-trifluoromethylphenyl epoxy resin / 3-trifluoromethylphenyl epoxy resin(4-TFMEP / 3-TFMEP)was prepared from it.There is a rigid biphenyl structure in this resin,and its curing substance has a higher heat resistance temperature.The fluorocarbon bond introduced also improve the hydrophobic properties of the resin system.At the same time,we also put the spherical alumina,aluminum nitride in powder and hexagonal boron nitride between three kinds of thermal conductive filler and three type fluorine methyl phenyl epoxy resin composite,the preparation of the corresponding composite material,and the thermal conductivity and dielectric properties of polymer system,the relationship between polymer structure was studied.We carefully studied the thermal conductivity of three kinds of epoxy resin composites with different heat conducting fillers to provide the experimental basis for the possibility of these composites as heat conducting electronic packaging materials.