Preparation Of Environment-Friently High-Performance Composite Material Using For IC Packaging

Recently the development trend of Integrated Circuit(IC) are more integration,wiring minor and chip larger with the development of the surface mount technology(SMT). In order to meet the requirement, investigating and developing high performance EMC is necessory. For environmental protection, the European Union come out with two directives WEEE (Waste Electrical and Electronic Equipment)and ROHS(the Restriction Of the use of certain Hazardous Substances in electrical and electronic equipment).With the electric information product transformed to environment-friendly electric information product at home and abroad gradually, investigating and developing of the green EMC is of great significance, that will enjoy broad market prospects. Based on molecular design principle, the rigid biphenyl group had been successfully introduced into epoxy resin chains to prepare epoxy resin MEP and TMBP with liquid crystalline performance. The products were characterized by1H-NMR, FTIR, POM, DSC, XRD. The results showed that the structure of the products obtained was correct which could be used for manufacturing of molding composite for packaging of electronic units and IC. The curing kinetics and curing behavior of TMBP, ECN, TMBP/ECN was studied by DSC, using linear phenol-formaldehyde resin as curing agent and2-methylimidazole as curing accelerating agent. The curing kinetics of the system was studied by isothermal approach. The kinetic parameters of the curing reaction including the activation energy and reaction order were calculated, and the activation energy were calculated using Kissinger and Ozawa method. The reaction order were calculated by means of Crane theory. The curing process of the system was investigated. The comparison of the kinetic parameters indicated that TMBP have lower start-curing temperature and lower activation energy, but higher after-curing temperature.Overall, It required higher curing conditions after adding TMBP. The study of curing behavior would provide theoretical basis for EMC using for large scale IC packaging. We tested the melt viscosity of TMBP,ECN and TMBP/ECN.The result showed that TMBP had very low melt viscosity(about0.02Pa·s), that of ECN was0.59Pa·s, that of TMBP/ECN was0.15Pa·s with40%TMBP. The flow behave of the system filled microsilica was studied, too.The result indicated the system viscosity increased with filler increasing, particle size of microsilica and the match of that also had impact on viscosity.Finally, using high-speed premixture, twin roller mixing and injection molding processing technology, enviromental friendly high performance EMC was prepared. The main performance of EMC obtained were tested, the result showed that the EMC have lower water absorption and good flame retardance, reached UL94V-0. The EMC can meet the requirement of large-scale IC packaging.