Study And Application On Key Technologies Of Novel Multifunctional Microwave/RF Components Based On 3D Heterostructure

The microwave/RF components can be matched and connected with the front-end transceiver antenna and the back-end digital sampling and signal processor in the hardware of airbornes’ and space-bornes’ whole machines to ensure the high-speed,high-quality and stable transmission of the required signals in each required frequency band.However,in the limited volume and space,it is of great significance to carry out the research and application of key technologies on 3D heterostructure microwave/RF components with the characteristics of high integration,miniaturization and multifunction.Under the background of theoretical analysis and designing method of existing 3D heterostructure integration technology and packaging technology at home and abroad,this dissertation mainly takes the board level and the chip level multifunctional heterogeneity as the researching object,and set the design of components with high performance,high stability,high integration,low energy consumption and low transmission loss as the researching direction.By formulas,equivalent models to be established,and the field/circuit electromagnetic simulation,along with analysis upon a variety of dielectric processing material performance to be applied,the electromagnetic stability,thermal stability and the final experimental components’ tests and data researching,the key technology of 3D heterostructure multifunctional microwave/RF components is tackled,and thus derive its applications in military and civilian products series application.Finally,the reconfiguration and reliability of this technology in practice are verified.The main researching work and achievements of this dissertation are as follows:Firstly,the existing 3D heterogenous microwave rf circuit is systematically introduced.The development status of 3D heterostructure microwave/RF technology,3D packaging technology and millimeter wave/terahertz microcoaxial technology are reviewed comprehensively and systematically.The existing T/R components and 3D heterostructure microwave/RF circuit products are introduced in detail to show that 3D heterogeneity can provide functional reconfigurability for modular T/R components.The vertical interconnection breaks the monogeneity of the previous plane cascade mode,and facilitates the physical connection of the front and back stages to achieve the electrical performance required by whole machines.Combined with the development history of the above technologies,the main problems existing in the traditional planar packaging circuits are analyzed.Aiming at these problems,the researching contents of this dissertation are introduced explicitly in connection with the development direction of 3D isomerization,and the main innovations of this dissertation are provided.In order to verify the advantages of 3D heterostructure transmission lines such as air micro-coaxial over traditional planar transmission lines such as microstrip lines,coplanar waveguides(CPW)and substrate integrated waveguides(SIW)in impedance characteristics,shorter signal transmission path and wider passband,the internal relationship between important physical parameters of 3D heterogeneity and frequency,bandwidth,impedance is summarized.Secondly,the miniaturized high performance microwave/RF components technology based on the new processing technology is studied deeply.The chip level and board level packaging technology of 3D composite materials is both studied.In the mobile communication system(for example,missiles,satellites,etc.),especially when transmission frequency remains low,the space utilization rate of the traditional CPW and SIW transmission line structure is not acceptable.As a result,the chip level processing technology can effectively reduce the volume of the device under 3D encapsulation mode,realizing the device in chip formation,and increasing the space utilization rate.Among these,the multilayer vertical interconnect structure filter based on chip level MEMS lithography technology has miniaturized the volume and can stably cover multiple frequency bands within the radar band,which is an important way to realize high-density integration.In addition,the processing of micro-coaxial devices and systems needs to rely on wafer level processing,combined with a series of automatic micro-coaxial structure control technology,to complete the research on micro-coaxial transmission lines,devices and other high reliability technology,breaking through the difficulty of high-density processing technology within a small volume.The question on how to realize the micropackaging process based on board level 3D-SiP is highly consistent with the initial design to reduce the system error and accidental error caused by the processing technology,which is also the key to the excellent performance of 3D heterostructure stackable vertical interconnect microwave/RF components.The realizing technology of the new 3D-SiP microwave/RF T/R components and functional unit is studied.Through link design,parameter setting,device components simulation,etc.,high performance RF components is processed based on3D-SiP design technology such as microencapsulation,3D stacking,surface mounted technology,etc..Corresponding technical indexes are verified,and the advantages of multifunctional devices in limited volume are highlighted.Moreover,the functional unit design of the W-band miniaturized antenna array based on air micro-coaxial is to assure the feasibility and advancement of the millimeter wave/terahertz device encapsulated on the wafer level with its strong radiation,low sidelobe and high efficiency as goals,which is an important performance combining the processing realization and the electromagnetic performance of RF units.3D heterostructure electromagnetic coupling crosstalk reduction and isolation technology are studied.For multipath systems,it is necessary to consider how to reduce the electromagnetic interference and cavity effect between paths in narrow horizontal and vertical directions.Although the traditional SIW technology can reduce cavity resonance and crosstalk by adding resonant elements,the insertion loss is enhanced as well as the cost of increasing the system volume,which leads to the increasing of the noise factor of the whole system.In order to overcome this defect,and ensure that all qualified size range can still give play to performance advantages devices and module circuit,from a large perspective,RF and DC control circuit’s problem of signal interference and crosstalk can be solved through cavity separation design from top to bottom,and form the front-back vertical interconnect compact 3D structure design type at the same time.Therefore,the vital question on how to improve the interference control ability of devices in heterostructure environment is to be addressed urgently to improve electromagnetic compatibility.The optimization method of 3D heterostructure components’ field/circuit co-simulation is studied.When the frequency remains higher,the distribution parameters effect of transmission lines cannot be ignored.Parasitic inductance quantity,parasitic capacitance quantity and the high order modes will be introduced into system.The approach of combination of field and circuit can achieve the optimal state in physical connection between circuits,solving the problem of vertical interconnection matching within the limited space,and further resonance effect’s reduction.The analysis of electromagnetic field/circuit can be used to guide the design of certain circuit path’s compensation in 3D heterostructure process.Thirdly,the practical application of 3D heterostructure microwave/RF components integrated into functional microsystems is studied in detail.In a series of RF channel sectione lectromagnetic system with complete function,the whole machine using 3D heterostructure advantage of reconfigurable microwave/RF components is able to form RF microsystem with diverse work modes and frequency bands.After defining and setting several indexes as experimental objectives,validation based on 3D heterostructure novel multifunctional microwave/RF components with stable performance.Focuing on establishing collaborative design platforms of integrated systhetical RF microsystems which are provided with independently controllable designing ability on integrated systhetical RF systems,researches on 3D modules technology in broadband front-ends,frequency conversion,transmitting,data receiving and sending,etc.are developed.Experimental components of systhetical RF systems concentrate on solving the problems of electromagnetic compatibility and the heat dissipations under conditions of small volume,high density and various reused modes.