A Study On The Development Of Dicing Blade Using Photo-curable Resin

Now the grinding blade with diamond abrasives is the tool widely used in the dicing process of brittle-hard materials, which is not only for its economic reason, but also for its high quality of dicing. The resin-bond blade keeps its typical advantages that result in its wide application in silicon wafer dicing. But, as the resin-bond blade using phenol or polyamide resin is made by heat-pressing process, great consumption of energy and long processing time lead to the high cost of product and the bad working environment. On the other hand, various photo-curable resins are put into use with the development of RP (Rapid Prototyping) technology. Considering that the hardening time of photo-curable resin is the order of only ten seconds, it shows the significant value to apply these new kinds of resin as bonding material of a dicing blade instead of heat-hardening resin that keeps an hour order of hardening time. Aiming this purpose, a new kind of blade is brought forward, called as Photo-Curable Resin Grinding Blade (PRGB).The significance and the contents of the paper was expounded on the basis of the synthetical discussion about the development history, present situation and the developing trend on the finishing machining technology, and the cutting technology on the typical hard-brittle material at present was briefly introduced.In the second chapter the basic knowledge about the grinding tools was firstly introduced, such as the diamond, the grade of diamond, concentration. And the tradition process using heat-hardening resin such as phenol or polyamide resin as bonding was introduced. The advantage and the disadvantage about the traditional heat-hardening process also were presented.The principle of hardening process using photo-curable rein as boning and the knowledge related to the rapid prototyping were referred in the third chapter. And the theory of the compound material, especially the filling, was also introduced.In 4th chapter, the factors that influence the mechanical performance of the samples with photo-curable resin were expounded. Through the study on the related experiments and the contrast of the performance, the main factors were discussed,which have important impact on the final samples, such as the hardening time, the kind of resin taken as the bonding, the kind of the filling, the content of the filling in the bonding and the size of the filling. So the recipe fitting for the blade was decided.According to the recipe worked out in the 4th chapter the blades were made out. And the experiments about the cutting on the hard-brittle material, such as the silicon wafer and the LiNbO3 wafer, were taken to test the practical cutting result. Then the effects of the recipe were qualitatively assessed by the consideration on the spoilage of the blade and the quality of the cutting gap.The main conclusions were gathered up in the last chapter, and the further work on the theory and the technology also prospected.