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Study On Multilayer Shells Bond Device Design And Precision Control Technology

Posted on:2004-05-13Degree:MasterType:Thesis
Country:ChinaCandidate:X B YueFull Text:PDF
GTID:2121360122965432Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
In certain productions, multilayer shells assembly is the key components. Multilayer shells are bonded by stickiness technology. Multiplayer shells assembly have characteristic, which are high dimension precision, strict form and position tolerance, difficult bond technology and etc. At present, the bond technology for multilayer shells is operated by hand, which can be satisfied with production quality request. But there were some disadvantages that are instability production quality, poor reliability and behindhand solidify monitor method. In this dissertation, the present bond technology and the technology feature of multilayer shells are analyzed in particular. The research is deployed about multilayer shells bond device design and precision control technology. The main contents of this dissertation can be described as follows.Firstly, the bond basic principle and the common course of bond technology are briefly recounted. The technology course of preparing adhesives, gelatinize, dry by airing and solidify are particularly introduced. The factors, which influence bond quality, and the control technology's, which can improve bond quality, are analyzed. The characteristic of multilayer shells assembly is analyzed. At the action of vacuum press, multilayer shells distortion is analyzed with finite element method. Multilayer shells bond technology course, which can be operated by hand, is particularly introduced. The characteristic of bond course, the excellence and disadvantage of handwork operation are analyzed.Secondly, in order to improve multilayer shells bond quality and realize real time monitor in solidify course, two overall bond device projects are designed which based on the bond function requirement of multilayer shells. By contrast, multilayer shells bond device is designed which the T4280 twin columns coordinate boring lathe is used as the bond device labor flat roof. The structure characteristic and working principle are analyzed. The mechanical system, which is made up of support bearing machine, outer-layer shells inspiratory machine, rotary machine, inner-layer shells inspiratory machine, sensor orientation machine and etc, are particularly designed.Thirdly, the test and monitor system of multilayer shells is made up of grating sensors, grating numeral display instruments, multi-serial ports data collect card and computer and etc. The correlative technology of grating sensors, numeral display instruments and data collect card are introduced. Based on the multilayer shells device test and the real time monitor technology request in solidify course, the program flow chart is instituted. The data collect and disposal program are designed with VC++6.0 in Windows2000 environment. Computer data collect use asynchronous serial ports to communicate. The Win32 API functions are used to access RS232 serial ports in Windows2000. Accessing course has open serial ports, setting serial ports, data read and write, close serial ports. Data disposal and tolerance estimation use three points to confirm a circle to realize the accurate orientation for multilayer shells and the real time monitor at solidify course when they are bonded.Lastly, the T4280 twin columns coordinate boring lathe is used as experimentation flat roof for whole bond device. The detailed device installing technology request, bond technology criterion and each preparing work detailed rules before bond are established. The simulation experimentation workpieces of multilayer shell were designed and machined. At multilayer shells bond course, the different system experimentations and integration demo experimentation are operated which are made up of orientation, install and clamp, equality gelatinize, location monitor and etc. In experimentation course, the existent questions areparticularly analyzed which are airproof, sensor orientation, bond location emendation of multilayer shells, data collect and disposal program, sensor reliability and etc. The better projects are brought forward for questions.
Keywords/Search Tags:multilayer shell, bond technology, precision control, device design, experimentation
PDF Full Text Request
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