The Application Research Of Reliability Technology In Laser Wafer Cutter

With the development of science and technology, reliability technology is highly valued and widely applied as a specific subject. The great loss caused by the unreliability of products makes it quite clear that reliability heavily influences products quality. Still it is of key importance in improving living standard and the development of the country.The paper described the importance of reliability analysis in new product research, compared different reliability analysis methods and adopted FMEA and FTA in reliability analysis based on the reliability datas of Laser Wafer Cutter. According to the principle of the Laser Wafer Cutter, the paper chased down the potential failures and causes and, combining markets demands, analyzed reliability requirements of the machine. Then the author used FMEA to predict the failure causes of the machine. On the basis of FMEA datas, the paper established FTA trees, made the modularization of the trees and chose the proper method to calculate failure probability.During the work, the author found a more efficient way to calculate the least cut set to replace the conventional ways, which greatly simplified the process.The combination of FMEA and FTA in reliability analysis of Laser Wafer Cutter established the failure database and attained the failure probability as well, thus successfully solving the lack of failure diagnosis expierences, improving product quality and reducing costs.