Study On The Performance Characteristic Of ID Blade

ID slicing is an important process of the whole wafer processing. The subsequent produce efficiency of lapping, polishing and the final quality of IC will be impacted by the quality of sliced wafer greatly. The stress condition of ID blade and its influence factors are analyzed in the process of ID slicing. Thus, the rule of ID slicing will be further understood, which will contribute to improving the theory and technology of ID slicing, improving and optimizing the conditions of slicing, and improve the processing quality and reducing the production cost. Sawing force, stress state, initial tension, and blade wear have been studied systematically in this paper.1. Base on the force point of one diamond, the formula of ID sawing force was studied. The characteristic of sawing force and the influence of sawing parameter and workpiece on sawing force were analyzed.2. The stress distribution of ID blade about initial tension force, centrifugal force, and sawing force were studied. The influence of sawing parameter on the stess state of ID blade was investigated.3. The deflection, stress distribution, natural frequency and vibration mode of ID blade under uniform tension or uneven tension were investigated with finite element analysis.4. The topographies of blade wear surface were observed by means of scanning electronic microscope, and the wear mechanism of blade and the influence of initial tension on blade wear were analyzed.