Research On The Key Technology Of Wire Feed System Of Automatic Wire Bonder

In the 20th century,the microelectronics technology is still one of the basic technologies for the information industry. The wire bonder is an important device for the microelectronics manufacturing. Gold wire bonder is the core equipment among the wire bonding equipment. Wire feed system is an important component subsystem of wire bonder. The resistance control of the wire transmission and the force control of tension is the key technology of the wire feed system, which has a critical impact on the bonding quality.The project comes from the Country 973 Plan: High-performance Design and Manufacture of Electronic Products Niceties of the New Digital Theory and Methods, whose number is 2003CB716202. This article mainly researches on the key technologies of the fast wire feed system in the automatic gold wire ball bonder.According to the ball bonding process and technology requirements of the system, low-fiction system which consists of air guide and vacuum tension device is designed to reduce the resistance of the wire transmission. The models of air guide and vacuum tension device are established and the relationship between the control parameters and force on wire of those two parts are found out.Based on the model of the air guider and the tension device, according to the ball bonding process, two states are analyzed about the force situation of the wire.The mechanism of wire feed system, pneumatic control system and electricity system are designed. And the reliability of the force model of the wire in the air guide and tension system by experiment. Experiment on wire feed system is done and the result of the experiment meet the demand of the low fiction and quickness.