The Simulation Research Of Sputtering Of Solid Materials Surface By Energetic Ions

The interaction between energetic ions and material is an important forward research topic in physics, it has important applications in solid material surface modification, film synthesis, superfine microelectronics processing, biological material surface modification, inertial confinement fusion, and other fields. Solid surface ion sputtering, implantation, and other correlative research have become the hot in this field, it do not only reveals a number of important scientific problems, but also are closely related to the application of ion beam surface modification, surface structure analysis, ion sputtering deposition techniques. But the means of research restrictions, we are lack of a more comprehensive and systematic understanding about the thin film growth mechanism with the ion sputtering deposition method. So it is necessary to conduct an in-depth study. The focus of this paper is to research the microcosmic physical mechanisms of solid surface ion sputtering. Materials by ion bombardment will be sputtered, and also other physical phenomena will happen. We can use LSS theory, molecular dynamics, Sigmund theoretical models and other methods to simulate the process. In this paper the interaction potential of the various models were described in detail; using universal potential ZBL model to calculate the interaction potential between Copper and Argon; using embedded atom potential to calculate the Cu-Cu interaction potential and force expressions; giving relative molecular dynamics computer algorithm; a detailed description of ion-solid interaction in theoretical and experimental aspects research, sputtering mechanism; finally using SRIM2006 software to simulate the ion sputtering, the simulation results is agree with the mechanism and experimental research .