Research Of Equipment Of Measuring Mechanical Properties Of MEMS Materials

With the development of Microelectromechanical System, it is found wide application in lots of fields in recent years. However, people inevitable encounter a lot of mechanical problems in product design, processing, packaging and reliability testing. The mechanical properties based on MEMS technology has fallen far behind the design and fabrication process of MEMS, and become a bottleneck problem impeding the development of MEMS, so the research on mechanical properties of MEMS materials is one of MEMS fundamental theoretical research fields. In order to obtain the mechanical properties of MEMS materials, it is necessary to develop a test instrument which is used to measure mechanical properties of MEMS materials.Investigating the related home and abroad literature and requirement of measuring mechanical properties of MEMS materials. A new test instrument that is used to obtain the mechanical properties of MEMS materials is presented. The test instrument consists of four parts namely specimen clamping subsystem, precision position/load subsystem, load and displacement measuring subsystem and measuring and controlling subsystem. In this thesis, the following studies on the test instrument are completed.(1) Investigating the related home and abroad literature and requirement of measuring mechanical properties of MEMS materials. Based on request about the test instrument of measuring mechanical properties of MEMS materials, a whole design plan for the test instrument that is used to obtain the mechanical properties of MEMS materials is presented.(2) Designing specimen clamping subsystem and precision position/load subsystem, then the important flexible hinges are analysed.(3) High-precision position mechanism and low- precision position mechanism are combined in the precision position/load subsystem, and then importantly bridge-type compliant distance-amplify mechanism of the precision position/load subsystem is studied farther. The analytical model of bridge-type compliant distance-amplify mechanism is founded and the static and motile theoretical analysis by the finite element method is carried out. The result of the theoretical analytical model matches the result of the finite element method. The conclution of model proves the job of the thesis right and ensure the precision position/load subsystem to work well.(4) Specimen clamping subsystem adopts compliant parallel four-pole mechanism, the analytical model of which is founded. The static and motile theoretical analysis by the finite element method is carried out and the result of the theoretical analytical model matches the result of the finite element method. The specimen and the specimen clamping mechanism are integrated on the silicon substrate with MEMS process, then presenting idiographicly the flow of MEMS process.If the test instructure for measuring mechanical properties of MEMS matericals in the thesis can found the basal theoretics, which afford a kind of effective instrument for study of measuring mechanical properties of MEMS matericals. Simultaneously the work in the thesis has laid a solid foundation for its future research.