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Study On Micro Three-Dimension Movable Device Fabrication

Posted on:2009-05-15Degree:MasterType:Thesis
Country:ChinaCandidate:L C YuFull Text:PDF
GTID:2121360272970366Subject:Micro-Electro-Mechanical Engineering
Abstract/Summary:PDF Full Text Request
With the rapid development of MEMS technology , three dimension device and mechanism which integrates mechanical, electrical, optical and biological function received more researcher's attention. Three dimension device and mechanism can be widely used as sensor, actuator to control motion or convey energy. As miniaturization and integration trends of devices, MEMS fabrication technology represented by UV-LIGA technology gets wide application, it makes three dimension micro-structure and three dimension mechanism fabrication realizable.In this paper, existing micro-three-dimension structure fabrication technologies were analyzed, and an applicable, inexpensive and easy to implement fabrication process was adopted. This process is a combination of SU-8 thick film lithography process, micro-electroforming process, backless board growing process and sacrificial layer process. Using this technology, a kind of three dimension micro-mechanism was fabricated directly on mental substrate. Micro-part of the mechanism is a movable part, and its aspect-ratio reached 8:1, the ratio of length of cantilever and width of bracket reaches 33:1. The fabricating method of the mechanism can be technical guidance for these kinds of micro-device fabrication.In three dimension micro-mechanism fabricating process, the problems existing in SU-8 film fabricating process, microstructure growing process and releasing of movable structure process were solved, and thickness non-uniformity of electroforming of low-aspect-ratio structure was studied. In this paper, method of dividing cathode was applied to redistribute current density on cathode to improve uniformity of current distribution on cathode, and improving thickness uniformity of electroforming. The results of finite simulation analysis of current density distribution and electroforming experiment show that adopting a proper method to divide conductive zone can improve current density distribution on cathode, namely, method of dividing cathode can improve thickness uniformity of electroformed structure. In the experiment results, the ratio of edge to center reduced from 2.91 to 1.88, electroforming uniformity was improved obviously.
Keywords/Search Tags:Three dimension micro-device, Micro-fabrication process, Micro-mechanism, Electroforming uniformity
PDF Full Text Request
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