Temperature Field Simulation And Analysis In High Efficiency Deep Grinding Of Engineering Ceramic Using Finite Element Method

Engineering ceramics has been widely used for its high strength, low expansion rate, abrasion and high chemical stability. At present, there are always two methods used in the ceramics machining, generally grinding and high-speed superficial grinding, which are inefficient and high costed. Another method, high efficiency deep grinding (HEDG) with its large cutting depth and high grinding speeds, carry out higher removal rate and better surface quality. Because the specific grinding energy is very high, most of the energy will flow into the workpiece, which will make temperature of the grinding zone raise up. When the temperature is very high, the metallurgical structure of the workpiece will change, which may even appear thermal damage and grinding crackle. Therefore, it is very important and realistic to research the ceramics grinding temperature for the thermal principle exploring and the grinding surface quality controlling.In this paper, the high efficiency deep grinding temperature field has been analyzed with the analytical method firstly, then focus on the finite element method (FEM), the trend of HEDG temperature field of the two engineering ceramics materials Alumina and partially stabilized Zirconia are analyzed in detailed with the grinding parameters such as wheel speed, cut depth and table speed. And the HEDG temperature field of Titanium Alloy is predicted later. The thermal stress of the engineering ceramics impacted by grinding temperature is also analyzed in this paper, and the results are used to discuss the grinding heat cracks. At last, the analysis results of FEM are proved by the experience.The research indicated that, with the finite element analysis software ANSYS, the simulation analysis for HEDG temperature field only have few errors compared with the experimental results, and have a more accurate reflects of grinding temperature field than the analytical solution. There are many differences of the temperature field between superficial and deep grinding, and the temperature field has different trend with different material. Compared with the deep grinding, material by superficial grinding is less affected by the high temperature, but it has larger temperature grads. The high temperature gathered on the surface material but a little effect on the surface below. For the material with bigger heat transfer rate, temperature has larger effect on its surface below, but the temperature gradient is relatively small. The wet grinding can reduce the grinding zone temperature effectually, which is more availably to material with bigger heat transfer rate. It also indicates that there is certain relationship between temperature grads, thermal stress and the formation of heat cracks.The production of this paper opens out the internal rule of HEDG temperature field and thermal stress of engineering ceramics; it is helpful to set up perfect HEDG basic system info, and it also has certain guiding sense for the manufacturing.