| The epoxy resin containing naphthalene and dicyclopentadiene group was synthesized using a better technology.The structure was confirmed using FTIR, NMR,and GPC,the epoxy value of 0.29 mol/100g was measured by hydrochloric acid-acetone, the melt viscosity of 0.3 Pa.s was measured by the rotational rheometer.Using linear phenolic resin of curing agent to cure resin, the cured products was obtained.The Tg of 179.4℃was measured by DMA, the thermal decomposition temperature of 352℃was measured by TGA, which showed good heat resistance, and cured resin showed good humidity resistance by the water absorption of 0.901%.The 4-hydroxyphenyl-4-hydroxybenzoate of Liquid epoxy resin was synthesized analyzing several affected factors of synthesis. The structure was confirmed using FTIR.The crystalline was studied using XRD. The phase behavior was evalucated using POM with a heating station and DSC.The melt viscosity of the resin was measured using rotational rheometer.The results showed that liquid-crystalline state was occurred during cooling liquid of the synthetic resin.The cure kinetics for curing system of NDEP/PN,ECN/PN,NDEP/ECN/PN was investigated by DSC under non-isothermal conditon, the activation energy was figured out using Kissinger and Ozawa method model, the reaction order was calculated by Crane method. The results showed that NDEP was easier to cure because of not very high activation energy and reaction order compared with ECN.The optimized process conditions was obtained by temperature of curing characteristics:pre-curing 30min at 140℃, curing 1h at 160℃, curing 2h at 180℃, the final curing 30min at 190℃.Silica for epoxy molding compounds (EMC) was modified by plasma surface polymerization using RF plasma, and the effects of plasma power, gas pressure and treatment time on surface treatment effects of silica were investigated systematically.The monomers utilized for plasma polymer coatings were pyrro le,1,3-diaminopropane,acrylic acid and urea.The plasma polymerization coating of silica was characterized by FTIR and contact angle. Using the silica treated by plasma as filler, the EMCs used for the packaging of large-scale integrated circuits were prepared, The results show that the surface of silica can be coated by plasma polymerization of monomers,and the comprehensive properties of EMC were improved.Using classical particle accumulation theory, the particle distribution according with Dinger-Funk-Alfred equation were calculated by Matlab simulation software, and then the optimal particle size formulations were obtained. Adding the mixed silica according to the above optimal formulations into epoxy resin.The melt viscosities of varied EMC were measured by Rotating Rheometer and Capillary Rheometer respectively. The results showed that the matching filling of different silica with different particle size can improve the flowability of EMC greatly.
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