Development Of Modified Resin Bonded Diamond Wire Saw

Fixed abrasive diamond wire saw is more and more attention because of its thin kerf loss,better wafer quality,high cutting efficiency,environment friendly,ability to machine hard and brittle materials,and so on.Resin bonded diamond wire saw,one of fixed abrasive diamond wire saws,will be used to process hard and brittle materials because of its simple manufacture technics,short manufacturing cycle,low cost,and better processing quality than electroplated diamond wire saw.However,resin bonded diamond wire saw easily becomes ineffective because of its poor adhesive ability,abrasion-resistance and heat-resistance.Modified research of resin adhesive was analysed in this paper.The impact of various elements to resin adhesive was researched.The manufacture technics of resin bonded diamond wire saw was also developed in this paper.First,the feasibility of modified resin was analysed theoretically.By analysing the problem of resin bonded diamond wire saw,high-performance resin,high-performance liquid rubber,nanometer particles and silane coupling agent were used to enhance heat-resistance,abrasion-resistance,toughness and high adhesive ability.The impact of various elements to resin adhesive was optimized by using orthogonal experiment.Manufacture technics of resinoid diamond wire was researched.Core wire and diamond abrasive were chosen and surface disposed.Resin adhesive was confected by using ultrasonic dispersion method.Resin bonded diamond wire saw was manufactured by using self-regulating coating tool.Five test levels of diamond abrasive were taken.The research how the amount of diamonds impact the performance of resin bonded diamond wire saw was finished.Using a certain length of the wire saw cutting area evaluated the performance of the wire saw.Resin layer along the wire axis should be well-proportioned to ensure the surface quality of workpiece.Resin layer in the radial wire should be consistent to avoid wire's abrasion early.A self-regulating coating tool was used to increase the quality of the wire.The developed resin bonded diamond wire saw was evaluated in this paper,and it was found that resin bonded diamond wire saw had stable diametral dimension and axial dimension,good appearance.The difference of diametral dimension was less than 0.004mm.Excellent slicing performance and good surface quality were obtained when we sliced silicon crystal using resin bonded diamond wire saw.