Study On The Cutting Quality Of KDP Crystal By Resin Adhesive Fixed Abrasive Diamond Wire Saw

KDP(Potassium Dihydrogen Phosphate) is a kind of excellent nonlinear optical crystal, which has been widely used in laser and nonolinear optical and inertial confinement fusion contour technology field. KDP crastal with anisotropic, soft and easy deliquescence, high brittleness, the change of temperature sensitive and easy to crack and the characteristics of optical processing, making it extremely difficult to processing one of the materials. Wire saw cutting technology is widely applied in cutting stone, silicon materials because of its many advantages in processing. In this paper, the wire saw is applied to cutting of KDP crystal. The experimental methods and the theoretical analysis are synthesized for study on the cutting quality by fixed abrasive diamond wire saw, this is of great importance for the subsequent processing, and the main work is as follows:According to Norman principle in the physics of crystal, by analyzing the distribution in the plane of the saw wire on boths sides, get the wire approach which make the elastic modulus differences is minimal, choose this direction as a preferred direction of wire saw cutting. Get the diamond wire saw cutting KDP crystal geometry model and crystal lattice position diagram. Through the method of coordinate transformation get the size of the plane elastic modulus KDP crystal, based on maintaining the minimum principle of the material removal rate differences on both sides of the wire, get the suitable wire approach direction in the (001) plane, doubler plane and triplor plane.Adhesive fixed abrasive diamond wire saw is used for KDP crystal slice experimental research,(001) plane and [100] crystal orientation is used for cutting crystal. By TR240portable surface roughness instrument for measuring the surface roughness of the chip size. Orthogonal test design method is used to analysis of cutting parameters on the surface roughness of KDP crystal effect.Get the cutting parameters when the surface roughness is smaller. Cutting surface morphology was observed through the scanning slectron microscope (SEM). KDP crystal surface morphplogy (potholes and micro crack) under various cutting parameters was researched. In order to get the optimal cutting parameters level combination scheme, the cutting parameters were optimized by orthogonal tests. The optimal level in combination has good agreement with experimental results. According to the saw wire geometry motion relationship with KDP crystal, single diamond grits of the maximum cutting depth was got. By comparing the maxium cutting depth with critical cutting depth, the relationship between saw wire speed and workpiece feed speed was got when the KDP crystal meet plastic domain sawing. The wire saw process of abrasive cutting function approximation for the normal force and tangential force of pressure head moving process. Based on the indentation fracture machanics theory and comprehensive consideration of the grinding grain beneath the elastic stress field and residual stress field in the influence of a crack propagation, established to predict wire saw cutting maching KDP crystal process central Asia surface damage layer thickness of the theoretical model. Get the transverse crack depth, median crack length, the surface damage layer thickness and cutting parameters of the quantitative relation with the test.