Resin Bond Diamond Saw Wire Developed

In the process of cutting hard-brittle material, especially of slicing single crystal silicon, fixed abrasive diamond wire saw is widely used because of its high-performance, less cutting loss, environment friendly and so on. The abrasive diamond wire saw fixed with the resin adhesive (ADWR) is expected to be used on an industry basis on slicing hard-brittle material, because its manufacturing cost is low, and it can bring excellent surface. It is developed of the technique of manufacturing ADWR in this paper. And it is also optimized of manufacturing conditions of ADWR in this paper. Research work and the results are given in the following:(1) The piano wire is chosen as the core wire of the ARWR which is used to slice forward and back, while stainless steel wire as the core wire of the annular ARWR, by general analysis and contrast according to the manufacturing method of the ARWR and the desire of slicing technique. The abrasive and the resin adhesive bond is also be researched. The cubic diamond with the grain size of #800 is chosen as the abrasive. And it is found that the liquid phenolic resin fixed with epoxy resin and nanometer powders shows excellent characters. At the same time surface disposal of various materials used in the AWPR is researched and determined to boost the abrasive grain retaining strength of resin and the adhered.(2) The manufacturing process of the ADWR is researched and optimized. High-speed stirring equipment is adapted to mix the abrasive and the additive into the resin uniformly. Special coating tool is used to coat the core wire with the resin mixture. And it is need for the hardening process adapted to keep for certain time on different special temperatures.(3) It is researched and determined of the highest hardening temperature and the heat preservation time on the temperature by test. And it is also researched of the improvements of the wire saw cutting performance when some typical especially thin powders or nanometer powders are mixed to the resin respectively. Then it is optimized of the contents of the nanometer additive, the epoxy resin and the diamond abrasive in the resin mixture by orthogonal experiment.(4)The developed ADWR is evaluated in this paper. It is found that the diamond wire saw we manufactured has stable diameter dimension, good appearance and high mechanical property. Moreover excellent slicing performance is obtained when we sliced single crystal silicon with the diamond wire saw we manufactured. The main disabled forms of the ADWR included of the wear and tear of the resin bond, falling off of the diamond abrasive and the partial peeling off of the resin bond.