The Research Of Laser Machining In High-density PCB

This article first describes the high density PCB materials and laser drilling technology in domestic and international developments. Through the laser and the material interaction's process, analyzed the entire laser drilling mechanism. And to punch when produces the plasma effect, the orifice effect, between the PCB material performance and the laser parameter's relations have carried on the exhaustive elaboration. Thought that the YAG solid state laser is the PCB microvia processing best choice and has carried on the introduction to the YAG laser borer each composition system. Use large finite element analysis software on PCB laser drilling conducted simulation. Simulation of the entire laser drilling process carried on the fitting analysis to the result. Has provided one analogy procedure for high density PCB laser drilling when the parameter choice. Through using the data of YAG laser drilling to the PCB foundation plate's experiment.And unifies the analogue result, has carried on the laser drilling process study.Has carried on the laser drilling process analysis.Determines the laser output, pulse width and focused conditions laser parameters on the quality of small holes.Obtained to obtain the ideal eyelet quality, but to the laser drilling parameter's optimized method, was the PCB pore processing quality enhancement has provided the reference data.