The Research And Development Of Wetting Balance Equipment

In the process of electronics manufacturing, solderability, which refers to the capability of soldering between solder and substrate, is an important concept. The wetting situation between solder and substrate would reflect quality of solderability. In general, wetting situation affected by solder alloy elements, oxidation condition of surface, temperature and reflux. Researchers have developed many methods, such as solder ball test and wetting balance test in order to evaluate wetting situation which is called wettability.In this thesis, an equipment which can be used to evaluate the wettability by solder ball test and wetting balance test is developed. By analysis the result of curves, researchers can evaluate solderabilities of different lead-free solder, and improve the process of electronics manufacturing by analysis the result of curves..The research and development of the wetting balance equipment involves mechanical, electronic, computer control technologies. The control programs in upper computer are developed by LabVIEW (Laboratory Virtual instrument Engineering Workbench), and lower computer involves force-measuring system, motion system and heater system. Each subsystem can accomplish the function of wetting force measuring, mechanics moving and temperature of solder control. Upper and lower computers are connected by data acquisition cards and serial port, and finish the process of measuring wetting balance curve by related industrial standard. Then characteristic values are extracted from the curve by internal algorithm and saved as excel or html documents, which could be studied by researchers.