Design Simulation And Temperature Control Of Network Microchannel Heat Sink

With constant development of the electronic chip's main frequency, gradual miniaturization of its packaging, as well as the development tendency of multi-chip's high density packaging and multi-core chip, the large heat that the chip generates has become the bottleneck, which restricts improving heat reliability of the electronic device. Accordingly, the research on the heat sink that is small-sized, high working efficiency and may take out the heat inside of the three-D packaging will have wide application prospect.In this paper, a new type of network microchannel heat sink is designed. Based on micro-fluid's flow and convection heat transfer theory, by using network topological incidence matrix, flow balance equation and heat balance equation of this heat sink are built. The pressure difference between both sides of every channel and the temperature of every joint of channels are worked out by simulation. By a great deal of experiments, it is found that the experiment results of the pressure difference between both sides of the heat sink system and the temperature of system's outlet are consistent with the simulation results. Therefore, it is demonstrated that the network modeling method is feasible, and it supplies a method for designing large-scale, distributed and small-sized network heat sink.At last, the heat sink is applied in antenna panel. Aiming at its temperature distributing characteristic, the corresponding network connection way is designed, and fuzzy control theory is used to control system's temperature.