The Design And Development Of LF-loader Of LED Die-bonder

This paper is research on high speed and high precision LED (Light Emitting Diode) production machine Die-bonder which base on key technology of motion control, mechanical structure design and kinetics Analysis. According to the market demand, mechanism's advantages and disadvantages, working process control; we research and design a high speed and high precision new type cooperative production technology of light mechanism and electrical integration. Analyze international technology development of vertical LED device and mini-watt triode encapsulation. Put emphasis on mechanism design and analysis, precision structure optimize design, die-bonder's reliability and stability under multitask operating system. Finally its comprehensive properties can reach the international level and keep ahead in the domestic.This Project is come from Guangdong key fields and key breakthrough project bidding (TC05B372-1): Full Automatic Semiconductor Chip Die-bonder.Die-bonder is a complex high speed and high precision production machine. Because of its high technical requirement and lots of motion cooperation, it is hard to prevent equipment failure or promotion its working speed. Such as possible lead frame damage, lead frame missing, lead frame mistake transfer, chip missing or unable pickup, this will higher the cost of equipment service and lower the automation level. This paper combine production field analysis and high production principles, using mechanism optimize and Kinematics Analysis, rebuild a new type process mechanism to avoid low capability of present mechanism and high production cost. The main work of this paper contained:(1) Design a secure catching & travelling mechanism of lead frame. To combine lead frame property its separation require, using turning upload mechanism, vacuum absorb, slight lift-up mechanism, intelligent distinguish and guide screw separate technology to max lead frame separate efficiency. The innovations of this mechanism are: high precise location, intelligent control and mechanism cooperation.(2) Analyze on model optimization of LF—loader and camera mechanism. The function of LF—loader is receiving the lead frame when it's finish by other mechanism, it is a essential consist of machine's automation. This research reduce processing cost and complex operation in a considering way. Camera mechanism is similar in structure, but the design must consider the vibration effect and its stability. (3) Research on die-bonder's overall arrangement optimization. For the un-total consider of designing process, the layout coordination may be not as good as expect, this paper analyze the situation as a whole so to continue improve die-bonder's property. Such as mechanical function, the link up and changing ability, key component improvement.