Study Of Cu/Co Multilayer Film Prepared On The Substrate Of Silicon By Jet Electrodeposition

Due to its excellent properties, nano metallic multilayer film has been widely applied in manyfields. Cu/Co nano metallic multilayer film has significantly improved the hardness and wearresistance and excellent resistance to corrosion resistance，it is expected to become more superiorperformance of protective coatings. Functional thin films prepared on the substrate of silicon arewidely used in microelectronic circuit, semiconductor/metal contact and other occasions, with therapid development of microelectronic technology, the process to prepare good property functional thinfilms on the substrate of silicon began to get a much louder attraction. Jet electrodepositiontechnology belong to high speed electrodeposition technology, because of its low cost and highprocessing efficiency, at the same time can improve the performance of multilayer film at a certainextent, it has been widely used in preparation of nanometer multilayer films. In this paper, by usingthe self-designed jet electrodeposition processing system, the Cu/Co nano metallic multilayer areprepared on the substrate of silicon by jet electrodeposition,specific research contents are as follows:（1）Prepare multilayer film by using the self-designed jet electrodeposition system suitable forelectrodepositing on the flat substrate, and analysis the main factors in the process as well as the rangeof them, then design the experimental scheme according to need,and study the surface morphologyand characterization of structure of multilayer film by SEM and XRD,study the micro hardness ofmultilayer film by micro hardness tester, study corrosion resistance of multilayer film by Tafelcurve,study adhesion strength of multilayer film by the scratch test.（2）Study the theory about the adhesion on the different substrate thin film and their mechanismand learn how to improve the cohesion. Use scratch testing for the Cu/Co multilayer prepared on thesubstrate of silicon by jet electrodeposition, comparison the cohesion of different pretreatmentmethods, monolayer and multilayer films, and different scratches direction.（3）Analysis flow field of the anode nozzle, investigate the nozzle with different width and flowrate, and study the surface morphology and hardness of the prepared multilayer film, then study howthe nozzle width and flow rate affect surface morphology and hardness of the multilayer film. Choosethe width and the flow rate of the nozzle by theoretical analysis and experimental results.（4）Prepare Cu/Co multilayers on the substrate of silicon, analysis how the modulationwavelength、layer thickness and the roughness of the substrate affect the morphology and corrosion resistance of the multilayer film, and analysis cross section morphology and microstructure of thespecific modulation wavelength multilayer film.