Study On The Lapping Technology Of Diamond Slicing Knives Based On AE Monitoring

To observe microstructure of cells in areas such as medical and biological, cellsmust be made into slices, generally the thickness of ultrathin slices is less than60nm,micro defects existing in slicing knife edge will cause knife mark in cross section,therefore it is imperative to make research of diamond slicing knife lapping technology.Firstly, analyzing the functions of machining tools according to the demands ofdiamond slice knife, designing the instruments for high precision rotation, stability ofthe horizontal reciprocating movement, wide-ranging angle adjustment and convenientelectric control operation. To ensure the quality of grinding, applying acoustic emissioninstrument, optical microscope and atomic force microscope for real-time monitoring,online and offline quality detection.Secondly, observing the tendency of Energy and Peak Amplitude as the AE signalcharacteristic parameters, analyzing characteristics of acoustic emission signal in timeand frequency domain using spectrum analysis, Gabor transform and window function,and quantizing characteristic state through wavelet transform characteristic spectrumcoefficient method. Based on conclusions above, this paper discusses the threegeneration mechanism of the micro defects, and takes further study into processevaluation system on slice knife contact detection, vibration without reciprocatingmotion and micro defects.Then, by comparing the impacts of route and frequency in reciprocating motionunder optical microscope with micron scale micro defects, in order to ensure the goodquality grinding, choosing the smaller reciprocating route and higher frequency; bycomparing the impacts of the spindle speed and particle size under atomic forcemicroscope with nanoscale micro defects, concluding how the spindle speed andparticle size affects the quality of diamond slicing knife.Finally, using the dynamic link between Matlab and AE Sqlite database, writing theacoustic emission monitoring software, realizing real-time guidance of grinding process,and grinding diamond slicing knife under the optimized process parameters, which notonly achieve cutting edge without micro defects lager than20nm and average sharpness52.5nm, but also meet the slicing quality requirements.