Research On Manufacture And Performances Of Resin-bond Diamond Wire Saw

Due to the high cutting efficiency,low pollution of the environment,less cutting loss and good quality of slices,fixed abrasive diamond wire saw is more and more attention in the cutting field of solar silicon materials, and will be widely used to cut other hard and brittle materials. However, resin-bond diamond wire saw has the disadvantages of poor wear resistance, low holding force and uneven distribution of abrasive, which affect its service life. Againsting to the existing problems and processing requirements of the resin-bond diamond wire saw, and combining the properties of the as-used materials in this fields. In this paper, piano wire, heat resistant polyester and poly amide imide, diamond were respectively used as substrate, binder and abrasive.The effects of pretreatment of matrixes and surface modifications of abrasive on the cutting performance of wire saw were studied.According to the preparation process and thermal stability of resin,we determined using two-step curing method to make wire saw. The mine conclusions were as following:1.The matrixes were pretreated respectively by phosphating solution and silane coupling agent,the effects of this two methods on the surface morphology of matrixes, bonding interface between matrixes and resin,cutting performance of the wire saw were analyzed.The results showed that two kinds both could improve the cutting performance of the wire saw,the cutting performance of the wire saw with the matrix pretreated by silane coupling agent was better,and the cutting area was1.466mm2.2.The surface modifications of diamond were carried out respectively by KH-550silane coupling and polyethyleneimine (PEI),the effects of KH-550and PEI severally on the surface properties of diamond,the suspension property of diamond in resin liquid,associativity of diamond and resin and the cutting performance of the wire saw were researched.The results showed that:compared to the original diamond, the surface electrical behavior of modified diamond change significantly.Zeta potential of diamond increased observably under acid condition,and increased the repulsive force among particles;so it would improve the suspension stability of diamond in the resin liquid.The respective modification effects were better with2wt%KH-550or6wt%PEI when pH was6.And the surface wettability of resin to diamond and the interface combination were also both imp roved, thus improving the cutting performance of the wire saw.3.According to the analysis of the preparation process and thermal stability of resin,the wire saw was completely cured through twice heating.The Curing process was170℃/1min+220℃/30min.We found that when the content of diamond was10wt%of the resin liquid and selected nano SiO2wite content5wt%of the resin liquid,the comprehensive performance of the wire saw was better.The resin-bond diamond wire saw was made by the best process and formula,and its quality was evaluated in this paper.It was found that the resin-bond diamond wire saw had good surface morphology,and stable diametral dimension,the difference of diametral dimension was only0.005mm.Excellent cutting performance was obtained and the unit length cutting area was1.847mm2when we conducted cutting experiment with the resin-bond diamond wire saw.