The Synthesis And Research Of Boron/Organosilicon Modified Phenolic Resin Composite

Conventional phenolic resin is a phenolic hydroxyl group and the molecularstructure of the methylene group is easily oxidized, so that the heat resistance isaffected, and phenolic resin, low elongation, high brittleness, which greatly restrictsits application in high-performance materials. To improve the performance ofphenolic resin, expanding its scope of domestic and foreign trade and phenolicresin-modified phenolic resins for the plastics industry to carry out a lot of researchwork to improve its heat resistance and toughness is the development direction of themodified phenolic resin.In this paper, the performance of the synthesis can be used as ablative ablativematerials excellent base material for the purpose of modified phenolic resin, andgradually synthesized boron-modified phenolic resin, silicone-modified phenolicresin and modified phenolic resin borosilicate double. And through various testmethods and performance characterization methods to important physical properties,chemical structure, heat resistance, and modified phenolic resin curing process ofsynthesis were studied. By a large number of comparative tests, the basic set ofboron-modified phenolic resin, silicon element is chemically access to the phenolicresin to form a hybrid resin containing a silicon-oxygen bond structure,boron-oxygen bond. Modified phenolic resin, heat resistance, temperature resistanceand other thermal properties are much better than ordinary phenolic resin.Obtained by orthogonal common thermoset phenolic resin synthesis optimumconditions, the optimum conditions are: the amount of phenol formaldehyde molarratio of1:1.4, catalyst NaOH dosage of5%phenol quality polycondensationreaction time1.5hours at reflux temperature of the reaction110℃.Determined on the basis of common thermosetting phenolic resin on theoptimum reaction conditions were added boric acid, phenyl triethoxysilane wasadded and synthesis of both boron phenolic resin, silicone resin and the phenolic-modified phenolic resin borosilicate bis. By means of Fourier transform infraredspectroscopy to characterize the structure of synthetic resins were characterized, theresults show that the modified phenolic resin to bond the way to access the elementsboron and silicon, is not a simple blend, reaching the chemically modifiedpurposes.