Numerical Simulation And Process Optimization Of The Injection Molding For Printer Board With Metal Insert

The insert injection molding technology is more suitable for the needs of the electronics,automotive and medical industries than the traditional injection molding.For the existence of the metal inserts,product structure becomes special;Molding process becomes complex;The warpage and deformation becomes difficult to predict and control.So,the improvement of warpage and the parameter optimization of the molding process are the important issues which need to be studied further for the printer board with metal inserts.The main work of this paper includes:1) Based on the engineering experience and the structural characteristics of products,three different design solutions of the gate are presented according to the aspects of the position,number and size of the gate,respectively.Furthermore,the numerical simulations of the design solutions are performed by using the Moldflow software.Then,the best solution of the gate is determined after comparing these solutions.Lastly,the suitable gating system is designed.2) According to the gating system design,the injection molding products large warpage obtained after injection and it needs to be improved.The Surface point cloud data of warpage is measured by ATOS Core optical scanner;then the point cloud data is obtained by the numerical simulation of injection molding with the above scheme;and combined with the Reverse Engineering software Imageware,the numerical simulation results and measurement results of two points cloud data are studied contrastively,on the one hand,to verify the feasibility of injection molding simulation;on the other hand,to analyze the reasons of products warpage.3) Based on the single factor experiment,the influence law of single factor change on products warpage is analyzed,and the various process parameters on influence trends of the product warpage are obtained.4) The L18 orthogonal experiment is designed by Taguchi technology.Through the numerical simulation Moldflow,the warpage is analyzed under the different factors,such as mold temperature,melt temperature,packing pressure,injection time, packing time and cooling time.According to the range analysis and variance analysis difference analysis,the best process parameters are obtained.The results show that the influence of melt temperature,pressure and packing time are highly significant.The mold temperature and injection time have a less impact on the cooling time warpage.5) Lastly,the mold with the optimal injection molding process parameters is tested.The injection molding products with qualified quality are obtained which verifies the correctness of the simulation results.Thus,it is shown that the optimize of the injection molding process and the decrease of the warpage can be easily realized by the combination of the orthogonal experiment technology and CAE technology.