Studies On Synthesis And Performance Of New Oligomerization Quaternary Ammonium Surfactants

In this thesis, we prepared 1,3-bis[3-(dimethylamino)propyl]urea by heating together one mole urea with two moles dimethylaminopropylamine at elevated temperatures and the polymeric quaternary ammonium compounds were prepared via a two-step nucleophilic substitution reaction using a ditertiary amine as a nucleophile and a dihalide as a reactant. The optimized synthesis conditions were studied on reaction temperature, reaction time and material ratio. The structures of the products were characterized using infrared spectroscopy (IR) and nuclear magnetic resonance (NMR) The polymerization degree and molecular weight of the compouds were determined by element analysis. The surfactants are oligomeric surfactants, their polymerization degree is between 1-5 and average molecular weight is between 600-1400. The effects of quaternary ammonium compounds with different hydrophobic groups on copper electrodeposition were investigated. The galvanostatic measurements with the injection of different compounds were performed on a RDE electrode. The introduction of these compounds gives rise to quantitative differences in the suppressing capability (ΔE). The highest suppressing capability can be noticed for the compound 1d containing hexyl group (ΔE=0.47 V), whereas the lowest one exhibited for the compound 1a containing hydroxyl group (ΔE=0.36 V). The compounds 1b containing phenyl group and lc containing propyl group show the same ΔE value (0.44 V) which corresponds to a moderate suppressing capability. The differences in the suppressing capabilities among these compounds are probably caused by the hydrophobic natures of the compounds. The results obtained from SEM measurements indicate that the ionenes have a suppressing effect for copper electrodeposition and the presence of the compounds in the electrolytes may produce regular and relative leveling morphologies of copper deposits. The via-filling experiments without SPS exhibit that an almost complete filling was achieved for compound 1d (C6 alkyl chain as a hydrophobic group), whereas a bad filling was obtained for compound 1 a (C3-OH chain as a hydrophobic group). With SPS, the vias were perfectly filled both for compound 1a and Id. However, the initial increment of growth was still conformal for the compound 1a. These results indicate the influence of the hydrophobic groups of the quaternary ammonium compounds on the filling behaviors and they are in agreement with the galvanostatic measurements at different electrode rotation speeds.