| The effect of electrostatic and radio frequency (RF) and mechanism of action to semiconductor bridge (SCB) explosive devices were analysed in this paper. According to the structure size and electrical parameter properties of SCB, the reasonable plan of electromagnetic compatibility (EMC) design was obtained. The paster capacitor and transient voltage suppressor (TVS) diode were used to study the effect and law of electrostatic and RF to SCB, and the influence of two components to electrical explosion properties of SCB was analysed. The mainly conclusions are as followes:(1)101-type and 104-type paster capacitors can significantly improve the RF protection ability of SCB, while in parallel with SCB to form a current bypass, which has the smaller impedance between the range of certain frequency;(2)Because of DC-blocking property of the paster capacitor, the capacitor discharge energy can not affect the electrical explosion performance of SCB;(3)The results show that three kinds of SMBJ-type chips, whose protective capacity increase from SMBJ10CA to SMBJ22CA to SMBJ75CA, can protect SCB devices from RF significantly. The TVS chip that has larger parasitic resistance generates high temperature to change the performance of explosive during the protection process, but has no effect on the electrical explosion performance of SCB. By comprehensive analysis, the SMBJ-type chip which has larger junction capacitance and smaller parasitic resistance has better RF protection performance, and does not affect the electrical explosion performance of SCB after the impact of RF;(4)SMBJ10CA chip can effectively improve the electrostatic protection ability of SCB, and SMBJ22CA chip has the protection ability a little less than SMBJ10CA, while SMBJ75CA chip almost has no protection to SCB. Analysis showes that the TVS chip that has lower breakdown voltage and smaller parasitic resistance can form the low-impedance bypass static current to significantly improve anti-static capacity of SCB;(5)SCB explosive devices in parallel with SMBJ10CA chips delays about 2μs firing time, but have no changement on the ignition energy under the condition of 47μF and 22 V capacitor discharge, while SMBJ22CA and SMBJ75CA chips shall not affect the electrical explosion performance of SCB. The TVS chip whose breakdown voltage is lower than the firing voltage of SCB divides current to delay the firing time of SCB, reversely, the chip will not affect the electrical explosion performance of SCB while its breakdown voltage is higher than the firing voltage;(6)To sum up, the paster capacitors can only be used for the RF protection of SCB, while the TVS chips for both electrostatic and RF protection. The TVS chips whose breakdown voltage is higher than the ignition voltage, which has larger junction capacitance and smaller parasitic resistance, should be selected to protect SCB device from electromagnetic. |
