Structure Design Of Flat LED Wire Bonder And Simulation On Key Parts

This paper according to the plane and high power LED packaging process of ultrasonic gold line bonding requirements, research and development automatic flat LED wire bonders, design related mechanical structure, and do simulation and analysis on the key components, design scheme has certain theoretical significance and practical application value.This paper to finish the LED wire bonder mechanical design and simulation includes the following aspects:(1) Design of the frame feeder mechanism; The agency is LED from feeding, sending, bonding, which is the main part of the whole machine, the focal point of design including the automation feed mechanism and LED frame convey mechanism design.In the feeding mechanism, LED frame box needs different specifications, the box on the vertical feed mechanism to rely on their own gravity close to the feeding claw care; when frames in the material box be push completely or the box full with frames, the frame box pushed to the safe area to wait for workers replace it a new one, even realize the LED frames automatic feeding.The LED frame convey mechanism responsible for the LED frames sending and positioning, when the frames was pushed to the specify location on the convey mechanism, feeder claw clamp the frames delivered to the bonding position, then the paw institutions push down to fully compress the LED frames; bonding complete and sending frame to the material box by the feeder claw. The whole structure requires many degrees of freedom can be adapt to different specifications of the LED frames and make the bonding surface perpendicular to the bonding head.(2) Design of the bonding mechanism; bonding mechanism is the key pats to complete the gold wire bonding, the design of the bonding head is a direct impact on the effect of wire bonding, the mechanical design section is include the parallel X-Y table and Bonding head.Parallel X-Y table drive by control software, X-Y table can realize high-speed high-precision positioning, at the same time able to adapt to a fast start and stop, brisk and smooth bodies run; elastic decoupling devices using the flexible design. relying on the spring preload to achieve X-Y decoupling mechanism to reduce the impact.The bonding head adopt a eccentric wheel direct-drive by a servo motor, do swing back and forth with the slider-crank mechanism combination, bonding head, eliminating the need for screw, linear guide transmission links, reducing the weight of the bonding head, at the same time improve the efficiency of transmission; the rotation of the bonding head joint with the cross spring lamination, the impact is smaller, and gold wire bonding will be more stable.(3) Do simulation on bonding head mechanism by the multi-body dynamics software ADAMS, the kinematic simulation of the real environment and the movement of the mechanism, the key data such as:the trajectory of the bonding head and bonding contact force, verify that meet the design requirements, and for the results of the optimization analysis. The ideas and methods in this article to the flat wire bonder, is a certain reference for similar design, and laid a solid foundation for further research on the high-performance microelectronic packaging equipment.