Soi Micro Accelerometer Based On Mems Technology, Research And Design

MEMS technology is one of the most potential technical and it is a very active areaof research. MEMS technology is widely used in many fields, including defense,automotive, and biomedical. Micro-accelerometer is an important application area ofMEMS technology. The initial success of MEMS technology and commercialization ofproducts is the micro-accelerometer.The advantages of the micro-accelerometer with itssmall size, light weight, low power consumption and high sensitivity has become a keycomponent of the field of inertial navigation. The emergence of the SOI material letmicro-accelerometer has a new direction and focus. SOI micro-accelerometer hasbecome a research hotspot.This article outlined the applications of MEMS technology and the latestdevelopments at home and abroad and then introduced the main MEMSmicromachining technology. The comb capacitive structure of the micro-accelerometerwas selected as the main object of study. After the analysis of its operating principle, theperformance parameters of the micro-accelerometer in the open and closed loop twodifferent operating modes was researched, and the inherent stability of themicro-accelerometer was pointed out.The model of the comb capacitive micro-accelerometer was established andsimulated in ANSYS, including static analysis, modal analysis and harmonic responseanalysis. Static analysis got the displacement of sensitive mass and the maximum stressof micro-accelerometer in all directions. The results verified that the system would notfail. Modal analysis got the natural frequency of the micro-accelerometer and the resultswere consistent with the results of the harmonic response analysis. The law of variousstructural parameters on the impact of the resonant frequency of themicro-accelerometer was researched. The linearity of the micro-accelerometer wasresearched and the results showed its linearity was good. The folding spring elasticitycoefficient formula was calculated and the influence of structural parameters on thecoefficient of elasticity was discussed. The specific size of the micro-accelerometer wasdesigned at last. Finally, under laboratory conditions, SOI material was prepared by using the directbonding technology and the preparation process was given. According to the structuralcharacteristics of the comb capacitive micro-accelerometer, the sensitive mass andactivities comb were designed as a floating structure. The top silicon layer heavilydoped and back etching technique were combined and the production process of the SOImicro-accelerometer was researched and the specific process steps and process wasgiven.