The Research And Preparation Of High-Performance Epoxy Electronic Encapsulant

With the rapid development of the electronics industry,more and mor epoxy electronic encapsulants are being used,and their higher performance is required.In this work,a high-performance epoxy electronic encapsulant was developed.The basic formulation of the epoxy electronic encapsulant contained epoxy resin,curing agent,handener,heat-transfer agents and diluent.The content of the various components of the system were optimized based on the results of thermal analysis and mechanical properties tests.The encapsulant has tensile strength of58MPa,and the impact strength of34kj/n2.