Development Of Ion Conductive Polymers For MEMS Devices By Anodic Bonding

With the development of micro-manufacturing technology and large-scale integrated circuits, micro-electromechanical systems(MEMS) have become the world’s frontier areas of scientific research, it integrates many of the world’s scientific and technological achievements. MEMS manufacturing package is a very important part of the package, it’s quality directly related to lifespan and use of MEMS devices. Anodic bonding cooperation as a means of packaging process are being more and more researchers attention,because it’s simple, reliable connection, do not pollute the components, etc.Currently the most used material for anodic bonding are glass and ceramics, these two materials own limitations restrict the use of anodic bonding in the package. Ionic conductive polymers with polymer materials lightweight, corrosion, and good electrical conductivity, etc. It’ the best alternative to glass and ceramics bonding material, but specifically for anodic bonding of the ion conductive polymer and few it has been reported, the study by anodic bonding means an ion conductive polymer material with a great meaningful. This paper select polyethylene oxide(PEO) as a matrix, the alkali metal lithium salt(Li Cl O4, Li PF6, Li BF4) as the electrolyte, Si O2, Nacl as an inorganic filler.Using milling technology in different proportions in different materials under different milling parameters on the mixed powder ball milling, the resulting materials were analyzed after milling conductivity, combined with the preparation of the material properties of the parameters as well as anodic bonding material requirements, and ultimately selected using PEO-Li Cl O4 mass ratio of 10: 1 milling, ball milling process The parameters are: milling speed of 250 r / min, milling time is 8 hours, the ball feed ratio of 7: 1.Finally, the preparation of PEO-Li Cl O4 and anodic aluminum foil bonded together in key process parameters are: preheat 100 ℃, preset voltage 800 V, under the conditions of the bonding time 10 min, good bonding quality. Analysis of the bonding interface was observed transition layer, and further description of the preparation of an ion-conducting polymer anodic bonding to meet the requirements for MEMS device packaging.