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Study On The Formation Of Defects Of CrNx Thin Film By Magnetron Sputtering

Posted on:2016-08-26Degree:MasterType:Thesis
Country:ChinaCandidate:H LiFull Text:PDF
GTID:2271330482951242Subject:Materials science
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Physical vapor deposition( PVD) technology is a pollution-free coating technology. It has been widely used for the preparation of corrosion resistance,wear resistance and hardness coatings. Magnetron sputtering technology is advantage in low process temperature and high sputtering rate. Currently, it has been widely used in mold tool, construction and decoration industries.CrNx film is one of the coatings with properties of a good resistance at high-temperature, anti-oxidation, wearability. But the pinholes, stripping, big particles are always appearance for large area substrates by magnetron sputtering technology. Some defects, especially the threadbare pinhole defects, will be the fatal flaw for applications. Although many researchers are working in avoidable coatings, there are no systematic achievements and reasonable explanation yet.In this paper, the influence of the process parameters in middle frequency magnetron twin sputtering on the properties and quality of CrNx film was investigated. The achievements are following: 1. The influence of process parameters on the film defect formations and properties(1) With bias voltage cleaning, the effects of nitrogen partial pressure, target power and substrate bias on the properties and defects of CrNx thin films were investigated. And the processing parameters for different thickness of the film also have been found.(2) With glow discharge cleaning the substrates, the CrNx coatings demonstrated better properties. The physical mechanism was explored.(3) The high performance and less defects of CrNx films c an be obtained with a 0.5μm-thick chronium intergrade layer. 2. The shapes and structures of defects on the surface, and the mechanism of defect formation were stressed in this thesis.
Keywords/Search Tags:CrNx thin film, nitrogen partial pressure, bias voltage, target power, intergrade layer, defects
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