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Study On The Process And Properties Of CrN Thin Films Prepared By Plasma Enhanced Magnetron Sputtering

Posted on:2017-05-12Degree:MasterType:Thesis
Country:ChinaCandidate:M L WangFull Text:PDF
GTID:2271330485472275Subject:Materials Science and Engineering
Abstract/Summary:PDF Full Text Request
Magnetron sputtering technology is one of the important means of surface modification of materials in recent years. It has the characteristics of low temperature,low cost, high efficiency, etc and has the development prospect of industrial production and is widely used in the deposition of various compound films.With the development of modern industry, the coating of the traditional process is no longer satisfied with the harsh environment. Therefore, on the basis of the above method, the plasma enhanced balanced magnetron sputtering is used to prepare the coating, in addition to the above characteristics, also has the characteristic of high ionization rate.In order to obtain the high quality CrN films,the CrN films were deposited by plasma enhanced magnetron sputtering.Focusing on the influence of process parameters of nitrogen flow ratio and substrate bias on the organization microstructure and properties of CrN films.Respectively using scanning electron microscope, X-ray energy spectrum, X ray diffraction, Holzer effect instrument, step profiler, microhardness tester, friction wear tester and scratch tester were studied the CrN films of thickness, deposition rate, microstructure, morphology, chemical composition and mechanical properties.The results show that: with the increase of N2 content, the deposition rate of CrN film is decreased, and the reason is related to the conductivity of the film itself. CrN(220) diffraction peak gradually shift to a certain point. When N2 content is more than40%, Cr/N atomic ratio closes to 1:1 and the morphology will no longer change. with the increase of N2 content, the crystal structure turns from Cr2 N phase to Cr2N+CrN phase and then to CrN phase.Under the same sputtering power, the deposition rate decreases with the increase of bias voltage. The change of bias does not affect the chemical composition of the film, but the energy of the ions, thereby affecting the thermodynamic and dynamic behavior of the films. When the substrate bias voltage increased from-70 V to-125 V, the preferred orientation of CrN films is changed from(111) to(200).When the substrate bias is-70 V, the film has better mechanical properties...
Keywords/Search Tags:Plasma, Magnetron Sputtering, CrN Thin Film
PDF Full Text Request
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