The Preparation And Study On The Properties Of Inorganic Wheat Straw Particleboard

With wheat straw and inorganic glue as raw materials, inorganic wheat-straw particleboard was prepared by cold pressing technology and hot pressing technology respectively. In the part of cold pressing technology, the effect of glue-straw ratio and density of the board on physical mechanical properties of inorganic wheat-straw particleboard were studied. Scanning Electron Microscope (SEM), X-Ray diffraction (XRD), Thermogravimetric Analyzer (TGA) and Differential Scanning Calorimetry (DSC) were used to analyze the influencing mechanism of the glue-straw ratio and the density on the particleboard. In the part of hot pressing technology, the effects of glue-straw ratio, density, hot pressing temperature, hot pressing time and curing time of the board on physical mechanical properties of inorganic wheat-straw particleboard were studied. Scanning Electron Microscope (SEM) and X-Ray diffraction (XRD) were used to analyze the influencing mechanism of glue-straw ratio, density, hot pressing temperature, hot pressing time and curing time on the particleboard. The results of this study are list as follow:(1)In the part of cold pressing technology, the MOR and the MOE of inorganic wheat-straw particleboard firstly increased and then decreased with the increasing of glue-straw ratio. The IB of inorganic wheat-straw particleboard increased with the increasing of glue-straw ratio and TS decreased. The MOR and the MOE of inorganic wheat-straw particleboard can reach to 15.7M and 4040MPa respectively, the IB can reach to 0.67MPa, TS was drop down to 1.6% when the glue-straw ratio is 2.1:1.(2)In the part of cold pressing technology, the MOR, MOE and IB of inorganic wheat-straw particleboard were increased with the increasing of board density, and TS of inorganic wheat-straw particleboard was decreased. The final optimization the glue-straw ratio is 2.1:1, and density is 1.0 g/m3.(3)In the part of hot pressing technology, the MOR and the MOE of inorganic wheat-straw particleboard firstly increased and then decreased with the increasing of glue-straw ratio. The MOR and the MOE of inorganic wheat-straw particleboard can reach to 10.9MPa and 3524MPa respectively, The MOR, MOE and IB of inorganic wheat-straw particleboard were increased with the increasing of board density, but tend to be slow.(4)The MOR, MOE and IB of inorganic wheat-straw particleboard were increased with the increasing of hot pressing time, but tend to be slow. The MOR and the MOE of inorganic wheat-straw particleboard firstly increased and then decreased with the increasing of hot pressing temperature. The MOR was 10.94MPa when the hot pressing temperature is 70 ℃.(5) In the part of hot pressing technology, the longer of curing time of the board, the better performance that the board shows. But tend to be slow. The MOR was raised from 10.36MPa to 10.94MPa when the curing time of the board increased from 2w to 3w, increased 5.6% by comparison. The IB was raised from 0.54MPa to 0.66MPa, increased 22.2% by comparison. The final optimization of glue-straw ratio is 2.1:1, density is 1.2 g/m3, hot pressing time is 30min, the hot pressing temperature is 70℃, the curing time is 3 weeks.