Study Of The 3D Metallic Electrode Array By Micro Electroforming Technology

With the continuous development of MEMS technology,MEMS in other fields such as optics,electronics,biomedical applications have been increased gradually.The micro electroforming process which as a very important part in the technology of MEMS,has been paid more and more researchers' attention.Micro array electrode composed of multiple root of micro electrode combination and become,has a number of very excellent electrochemical performance,widely used in the field of micro machining and biological sciences,and thus become a focus topic in the field of micro machining.The micro electrode array has benn chosen as the research object,first,make sure the feature sizes of the electrode,and then make simple introduction of the two kinds of electroforming growth way based on the position of the seed layer,include blind hole filling and molding process,and then make specific inquiry like basic properties?spin coating?post bake?exposure parameters of KMPR photoresist and BPN-65 A photoresist which are chosen to the experiment,and know the differences between the plating and electroforming,and the reaction mechanism of plating solution and plating solution of each component in the role and influence on the effect of process conditions on plating have made detailed analysis.Then fabricated the micro electrode array,using KMPR photoresist and BPN photoresist spin the specified thickness,soft bake,UV exposure,post bake,development for the film structure,according to the different method of electroforming,respectively sputtering seed layer before soft bake or after the post bake sputtering metals were copper,about 300 nm(baked before the splash when first sputtering layer of adhesive layer metal chromium about 50 nm,sputtering seed layer),choose 190g/mL of CuSO4·5H2O,60g/L·H2SO4,70 mg/L chloride ion and configured by an appropriate amount of additives,electroforming and acidic copper plating process is adopted to set the current density of 1.5 A/dm2,electroforming,after polishing treatment,respectively,got the three cross section shape of a variety of micro array electrodes,finally present emission scanning electron microscope on the micro array electrodes made by observation.This paper,from the perspective of process,the microelectrode array as the research object,Inquiry into the KMPR photoresist,BPN photoresist and blind holes filling and mold electroforming,it would be help of researching of the micro electroforming.