Several Study Of UV-LIGA Procesing

With development of MEMS technology and advancement of MEMS machining techniques, it has become hotspot that designing and manufacturing various Micro Inertial Instrument by MEMS technology. Micro Inertial Instrument has so much advantage such as small volume, low weight, high integration, powerless and so on. It makes Micro Inertial Instrument have very large application foreground. The machining methods of Micro Inertial Instrument mainly contain filming technics, silicon technics and UV-LIGA. UV-LIGA has such advantage as high aspect ratio, excellence of Z orientation, various range of material. So manufacturing Micro Inertial Instrument by UV-LIGA has larger machining capacity and superiority.This paper considers UV-LIGA as study subject, optimizing the parameters of SU-8 lithography, setting up the flat of micro- electroforming, analyzing and optimizing the direct current electroforming and Reverse pulse electroforming.The main content is as follows:1. Optimizing the parameters of SU-8 lithography. This paper analyzes the theory of SU-8 lithography, uses experiment method, compares the result of SU-8 lithography experiment with different parameters, analyzes the influence of parameters in SU-8 lithography and finally gets the Optimizing parameters of SU-8 lithography.2. Direct current electroforming. This paper establishes the nickel sulfamate as main electrolyte of micro-electroforming considering the characteristic of UV-LIGA. And this paper analyzes the parameters of direct current electroforming through experiment method, finds the influence of micro-electroforming parameters such as temperature, current density and pH, and finds out the parameters of direct current electroforming which can give preferable electroplated layer.3. Reverse pulse electroforming. This paper carries out reverse pulse electroforming with the reference of direct current electroforming, finds out the influence and function of pulse time and peak value current density through experiment with different parameters, and finally carries out preferable electroplated layer with reverse pulse electroforming.This paper finds out the parameters of SU-8 lithography which is preferable by Optimizing and analyzing SU-8 lithography, and carries out the result which is cragged and with enough solidness. Through experiment of micro-electroforming, This paper gets brightness, uniformly, compactly and with average hardness electroplated layer with direct current electroforming and reverse pulse electroforming.