Study On Low Dielectric Loss Coppor-clad Plate And Its Electrical Insulating Substrate In High Frequency

With the rapid development of electronic industry, printed circuit board has been widely used in the electronic products. The performance of the special material based copper clad laminate requirements are increasingly demanding. Ordinary copper clad laminate has been unable to meet the requirements of high quality electronic products due to its high dielectric constant, high dielectric loss, high temperature resistance and high temperature stability, so it is urgent to develop high performance copper clad laminate.Because of its excellent electrical properties, mechanical properties, moisture resistance and dimensional stability, PPO has a very wide range of applications. However, polyphenylene ether resin has poor resistance to soldering and poor solvent resistance of halogenated hydrocarbon and aromatic hydrocarbon. Therefore, it is necessary to modify the properties of the resin, which can form a thermosetting resin, which can form a crosslinking curing.In this paper, the properties of the resin were improved by blending modification.Low molecular weight(PPO630) and epoxy resin(JP-80) were used to prepare the PPO/JP80 system, and low molecular weight polystyrene(PPO630) and bisphenol A type isocyanate resin(CEO1PO) were used to modify the PPO/CE resin system. Two kinds of resin systems were followed for the determination of gelation time—temperature dependence, high temperature tensile shear strength, contact angle and surface energy. In addition, using PPO/JP80 system and PPO/CE system as matrix resin, glass fiber as reinforcing material, copper clad laminates were prepared, and their mechanical properties, dielectric properties, electrical insulation properties, water absorption, resistance to soldering has been tested. With the increase of temperature, the gelation time of PPO/JP80 resin system and PPO/CE resin system were gradually decreased, and with the increase of the time, and with the increasing of the time, the gelation time at the same temperature point has decreasing trend. The apparent activation energy of PPO/JP80 resin system is between 55-65 k J/mol, and the apparent activation energy of PPO/CE resin system is between 85-90kJ/mol. The tensile shear strength of two kinds of resin system for stainless steel sheet are decreasing with the increase of temperature, and their tensile shear strength are both best after placing 24 h. The surface energy of PPO/JP80 resin system and PPO/CE resin system are 41.1mJ/m2 and 42.81mJ/m2, which are less than the surface energy of the water 72.8mJ/m2. With the increase of epoxy resin in proportion in PPO / EP, the bending strength of CCL increases, peel strength increases, the dielectric constant and dielectric loss factor increase, the volume resistivity increases, water absorption rate increases and high temperature resistance welding performance is enhanced; With the increase of cyanate ester resin in proportion in PPO / EP,the bending strength of CCL decreases, peel strength increases, the dielectric constant and dielectric loss factor increase, the volume resistivity increases, water absorption rate increases and high temperature resistance welding performance is enhanced.By comparing the experimental results, when mPPO:mJP80=1:1, the PPO/JP80 copper clad laminate is the best, and when mPPO:mCE=2:1, the integrated performance of PPO/CE copper clad laminate is the best.Add inorganic filler gas SiO2 to PPO /CE resin system and prepare copper clad laminate composites, we can find that with the increasing of gas phase mass fraction of SiO2, the mechanical properties of CCL improves to a degree and then decreases,t he dielectric constant and dielectric loss factor increase, the volume resistivity increases, water absorption rate increases.By comparing the experimental results, it is found that when the mass fraction of SiO2 is about 30%, the comprehensive performance of copper clad laminate is excellent.