| As the basis of the electronics industry,the performance of copper clad laminate(CCL)often determines the performance of the finished product.A major factor affecting the performance of CCL is the resin system,which can impart different properties to the CCL.Currently,epoxy resin(EP)is the most used type of resin in the CCL industry.Due to the depletion of non-renewable resources and the continuous deterioration of the environment,in recent years,bio-based epoxy resin(BOBER)has become a research hotspot due to its advantages of green regeneration and easy degradation.In this paper,the preparation of maleopimaric acid epoxy resin(MPAER)and dimer acid diglycidyl ester(DADGE)and its application in copper clad laminates were studied.The main research contents and results are as follows.(1)First,maleic rosin was separated and purified to obtain maleopimaric acid(MPA)by sodium salt method.The effects of the type of alkalis,the reflux time and the pH of the solution in the salt reaction on the separation were studied.And the products were characterized by FT-IR and NMR.Then,the maleopimaric acid epoxy resin(MPAER)was synthesized from MPA as the raw material,and the paper-based copper clad laminate(p-CCL)was prepared by replacing the resin with E-51 epoxy resin.The resin and its cured product were characterized by FT-IR and tested by TGA.The thermal properties of the cured resin and the effect of the resin on the gelation time of the p-CCL were investigated.The effect of the replacement amount of the resin on the solderleaching resistance,peel strength,bending strength and flame retardancy of the p-CCL was discussed.The results showed that the highest yield of MPA was 58.34%when the NaOH was selected for separation and purification,the pH value of the solution was 10 and the reflux time was 2.5 h.Compared with maleic rosin epoxy resin,MPAER cured product has better thermal properties.When the replacement amount of the resin is less than 60 wt%,the gelation time is shortened,and when it is more than 60 wt%,the gelation time becomes long.When the replacement amount of the resin is 20 wt%,the comprehensive performance of the prepared p-CCL is the best.Its peel strength is 1.7 N/mm,the solderleaching resistance is 55 s,and the warp and weft bending strengths are 362.9 N/mm~2 and317.7 N/mm~2,respectively,which are better than p-CCLs prepared by E-51 epoxy resin.When the replacement amount of the resin is less than 40 wt%,the flame retardancy of p-CCL reaches the highest flame retardant level of UL94V-0.(2)Using dimer acid(DA)as raw material,bio-based dimer acid diglycidyl ester(DADGE)was synthesized and used as reactive toughening agent to prepare p-CCL.The resin was characterized by FT-IR and TGA.The effect of the amount of epichlorohydrin and sodium hydroxide on the epoxy value of the resin,the compatibility of the resin in the glue and its effect on the gelation time were investigated.The effects of the epoxy value and the addition amount of DADGE on the solderleaching resistance,flame retardancy,water absorption,bending strength and impact strength of the p-CCL were discussed.The results showed when the molar ratio of DA to ECH was 1:8 and the molar ratio of DA to NaOH was 1:1.6,the epoxy value of DADGE reached the maximum value of 0.23 mol/100g.The DADGE has the best compatibility in a mixed solvent of ethanol and acetone(m=1:1),and the surface of the prepreg obtained is uniform.The DADGE can shorten the gelation time of the glue.The p-CCL meets the performance of the IPC-TM-650 standard.And when the addition amount of DADGE is less than 12 wt%,the flame retardancy of the p-CCL reaches UL94V-0 level.The p-CCL prepared by adding 6 wt%of DADGE with 0.08mol/100g epoxy value has the best comprehensive performance,its toughness and rigid are comparable to those of p-CCL with 12 wt%of commercially available high performance toughening agents and it has higher solderleaching resistance. |
PDF Full Text Request