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ISO3 Level Microelecronics Cleanroom With High Equipment Footprint Rate Airflow Research

Posted on:2017-03-05Degree:MasterType:Thesis
Country:ChinaCandidate:R Y HuangFull Text:PDF
GTID:2322330512461254Subject:Heating, Gas Supply, Ventilation and Air Conditioning Engineering
Abstract/Summary:PDF Full Text Request
With the continuous development of modern industry and continuous innovation technology, microelectronics semiconductor industry has become an important indicator to measure a country's comprehensive national strength. Microelectronics industry for the environmental control in the process of production is very high, so the study of microelectronics workshop clean room is of great significance. At present, China's microelectronics industry due to a late start, combined with the foreign technology blockade, make domestic microelectronics enterprise production equipment obsolete, big volume. The many effects on the clean indoor air distribution. Due to the high cost of the clean room at the same time, many domestic microelectronics enterprise to reduce construction investment will often equipment design is placed centrally, this makes equipment for clean room air distribution effect is more serious. This paper will be based on a domestic semiconductor factory the actual case of clean room, adopt the method of numerical simulation, the microelectronics industry at home and abroad, the study process and clean indoor arrangement. The main contents are as follows:First of all, by some microelectronics enterprise providing lithography between specific parameters and geometric parameters of process equipment such as the use of numerical simulation software Airpack clean room empty state and the static model, compare the results of calculation analysis of the current domestic microelectronics companies use technological equipment to clean indoor flow field velocity distribution.Then, based on CFD method, in view of the present domestic local semiconductor companies in the common process equipment volume is larger, the current situation of the high altitude, through the analysis between lithography equipment of a microelectronics plant height from 2.0 m to 2.7 m at the time of the numerical simulation results, the research on the clean indoor equipment highly the influence of work area, and study of the way by adjusting the supply air velocity to optimize the air distribution in the area, at the same time is given for the microelectronics workshop lithography between relatively appropriate supply air velocity. By studying the relationship between the workspace and the relative position between the head air diffuser, and analysis the relative position relations between workspace to meet production requirements. Using CFD software, in view of the concession rate lower than 60%, high technological equipment, the plant is given suitable width of the clean room work area.Finally, according to the analysis result, proposed in view of the domestic microelectronics cleanroom, optimization measures to improve its working air distribution in the area.
Keywords/Search Tags:Microelectronicsclean room, Numerical simulation, Air distribution, Equipment layout, Optimization measures
PDF Full Text Request
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