| Silicone resins are Si-O-Si-based chain,linking organic group of semi-inorganic polymer crosslinked silicon atoms,an organic silane polyfunctional hydrolysis and condensation formed in the heating or the catalyst can be further transformed into a three-dimensional structure of the insoluble and non-melting thermosetting resin.Silicone resin has excellent heat resistance and heat resistance,both excellent electrical insulation,chemical resistance,hydrophobic and flame retardant,other properties can also be achieved by modification.Therefore,the silicone-based materials made of electrical insulation paint,coating,molding compounds,laminates,release agent,moisture-proof agent and other products,in the electrical,electrical,electronics,aviation,construction and other industry department received a wide range of applications,is a very promising new green materials.With the development of polymerization theory and technology,silicone resin,which is one of the important products in the silicone system,has been paid much attention by scholars both at home and abroad.The main contents of this paper are as follows.1.The hyperbranched silicone epoxy resin was synthesized and its structure was characterized by NMR and Fourier transform infrared spectroscopy(FTIR),and its structure was proved to be correct.The hyperbranched silicone epoxy resin was cured by UV curing,and its cured product was studied.The properties of UV cured materials were characterized by thermogravimetric analysis,DSC and mechanical properties,The epoxy value is 612g per equiv,the weight of 5%when the temperature is 358 ℃,glass transition temperature is 60.67 ℃,compared with the traditional linear epoxy resin E-51,toughness Increased by 3～6KPa,breaking elongation increased by 10%to 17%and hardness and adhesion have also been improved.2.The low refractive and high refractive organosilicon materials with vinyl end-capping were synthesized and their structures were confirmed by NMR and Fourier transform infrared spectroscopy(FTIR).The solidification was cured by UV curing,and the thermogravimetric analysis,mechanical properties and light transmittance were analyzed.The tensile strength of the low refractive and high refractive organosilicon materials is 268 ℃ and 274 ℃ respectively,the tensile strength is 9.8KPa,7.1KPa,the breaking rate is 147%,132%,Light transmittance were 93%,98%,basically meet the requirements of LED packaging materials.3.A liquid polyhedral oligomeric silsesquioxanes(POSS)was synthesized and characterized by NMR and Fourier transform infrared spectroscopy(FTIR).The prepared liquid polyhedral oligomeric silsesquioxanes crosslinker has good compatibility and dispersibility,and the UV-curing epoxy resin obtained by adding polyhedral oligomeric silsesquioxanes has the characteristics of high temperature resistance and high hardness.High temperature temperature of 260 ℃ or more.The temperature at which the weight loss was 5%was 380 ℃,the glass transition temperature was 141 ℃,the tensile strength was 18.5KPa,the elongation at break was 135%.4.By means of UV irradiation,a conductive hydrogel with high adhesiveness and excellent electrical conductivity was prepared,and the performance of the conductive hydrogel was tested.Through the test,it can be found that as the monomer concentration increases,the water-swelling rate of the conductive hydrogel gradually decreases and the gel fraction increases continuously;the,conductivity of conductive hydrogels with different monomer concentration ratios is found to be certain.The conductivity of the conductive hydrogel can be adjusted by adjusting the ratio of AM and DAC in the system.With the increase of the monomer concentration,the degree of cross-linking and solid content of the gel increase,resulting in the rupture of the hydrogel.The rate gradually decreased. |
