The Performance Study Of Aramid Fiber Resin Film Used For Electrical Insulation

Aramid 1313,namely the poly benzene formylm-phenylene diamine(PMIA)has high temperature resistance,dimension stability,resistance to radiation,electrical and mechanical performance characteristics,which is widely used.At present,the aramid 1313 resin is mainly used for the preparation of fiber and insulating paper,but the studies about aramid fiber resin film has rarely been reported.Our research mainly from two aspects.First,with aramid fiber resin modified transformer insulation paper,we had a preliminary exploration on the modified insulation performance.Second,we made a new aramid insulation film.We studied the thermal aging properties of aramid fiber thin film.Using conventional thermal aging test method,thermal aging experiment was carried out under different temperature conditions.The research studied the aramid fiber resin film tensile strength,elongation at break,and breakdown voltage different parameters with the temperature changes in the rules.Using conventional thermal aging test method,we test the tensile strength of aramid fiber resin film,elongation at break,and breakdown voltage with temperature changes in the rules.We use tensile strength as the aramid outlast parameters of thin film thermal aging,Which based on the thermal aging model,.Then we discusses the relationship between the chemical reaction rate and temperature to determine the use of membrane ceiling temperature,heat resistant levels to carry on the forecast of thin film.At last,we observe the film microstructure change in the thermal aging process by TG-DSC,SEM,IR and other test means.The results show that:Because the aramid fiber resin solvent system contains cellulose degradation of calcium chloride,it makes modification insulating paper to be carbonized at high temperature;The results showed that the aramid fiber thin film thermal oxidation rate in line with the Arrhenius equation.The results showed that the aramid fiber thin film’s thermal oxidation rate is in accordance with Arrhenius equation.The use of the aramid fiber resin membrane ceiling temperature is 145 ℃,class B insulation heat resistant grades based on the relationship between thermal aging.In the process of heat aging.Polymer chains fracture without rules.With the increasing of the degree of crosslinking,small molecule reunion together,"agglomeration",appears at the surface of the internal structure degradation,neat arrangement of disintegration and disorder makes the decline in the strength and modulus of the material.This article provides an effective research method for rapid assessment of the polymer film heat aging resistance.