| Bismaleimide(MBMI)and phenolic epoxy resin(EPN)have good electrical insulation and processing fluidity,but the poor mechanical properties of crosslinking cured material limit the development and application of MBMI and EPN.In this paper,KH-SiO2/PES/MBMI-EPN composites had been prepared and studied,which bismaleimide-phenolic epoxy resin(MBMI-EPN),polyethersulfone(PES),and functionalized nano SiO2(KH-SiO2)were used as the matrix,the toughening agent,and the modifier,respectively.The curing kinetics of the resin system was studied by the non-isothermal differential scanning calorimetry and the optimum curing process was deduced,which was 120℃/1 h,+150℃/1 h,+180℃/1 h,+200℃/2 h,+230℃/1 h.The apparent activation energy of the resin system was calculated by Kissinger method and Ozawa method,which was 96.03 kJ/mol and 99.18 kJ/mol,respectively.The average activation energy was 97.61 kJ/mol.The results of Fourier transform infrared spectroscopy(FT-IR)showed that the unsaturated double bond in MBMI resin and the epoxy group in EPN resin were substantially eliminated,and a chemical reaction occurred.PES resin and KH-SiO2 did not participate in the reaction of resin system but existed in a multi-phase structure through interface interaction.The results of scanning electron microscopy(SEM)indicated that PES resin and KH-SiO2 had good compatibility in the resin matrix and formed a multi-phase structure,and the interfaces were stable.The properties of KH-SiO2/PES/MBMI-EPN composites revealed that PES resin and KH-SiO2 had good synergistic effect and could significantly improve the comprehensive properties of the composites.When the content of PES resin was 4wt%and KH-SiO2 was 1.5 wt%,bending strength and impact strength of the composites were 156.23 MPa and 20.89 kJ/m2,which were 49.7%and 82.8%higher than those of resin matrix,respectively.And the thermal decomposition temperature of the composites was 393.1℃and was 15℃higher than that of resin matrix.Furthermore,the dielectric constant and dielectric loss of the composites reached 4.55 and 0.0029 at 10 Hz,respectively.The volume resistivity and breakdown strength were 1.74×1014Ω·m and 29.11 kV/mm,respectively,which were68.3%and 35.9%higher than those of resin matrix. |