Equipment Development And Study On The Process Of Wire Polishing Reduction Part Of The Diamond-coated Wire Drawing Die

Diamond-coated wire drawing dies are widely used in the metal wiredrawing industry for the high-hardness and wear-resistant diamond coating on their inner-hole surface.The surface quality of the diamond coating has an important effect both on the durability of dies and on the quality of products.However,with regard to the tapered surface diamond coating on the reduction part of the dies,the polishing efficiency of the existing polishing methods is low and the polishing quality needs to be improved..A novel wire polishing method using electroplated diamond wire provides a new idea for the high-efficient and precise polishing of diamond-coated wire drawing dies.In this paper,a high-speed wire polishing machine and a special electroplated diamond wire for wire polishing were developed,and the polishing process was systematically studied.The main work accomplished is as follows:(1)By using block-based design,the motion module of mold base,the motion module of electroplated diamond wire,the control module and the machine body module were designed.After assembly and commissioning,the high-speed polishing machine was developed.The equipment runs stably and can be used for dies of different specifications,which meets the requirements of high-speed wire polishing.(2)According to the composite electroplating process,a special electroplated diamond wire was prepared,which was made of a piano wire with a diameter of 0.32 mm and diamond abrasive with the specification of W10.The electroplated diamond wire doesn't break easily with its abrasive grain uniformly embedded on the substrate and in good adhesion with the coating.(3)With the self-made wire polishing machine and the special electroplated diamond wire,single factor experiments were carried out on die speed,wire polishing time,stroke speed and tension force of the electroplated diamond wire.The effects of those parameters on surface roughness and material removal rate of diamond coating were analyzed,and the reasonable range of each parameter was obtained.(4)Orthogonal experiments were carried out on the parameters in the pre-selected range,and direct analysis method was adopted to obtain the optimal process in rough,semi-precision and fine polishing stages.Followed by the optimized wire polishing process,the surface roughness of the reduction part of the diamond-coated wire drawing die was reduced from 0.1um to 52.6nm.