Controller Reconfiguration And Processing Parameters Optimization Of Wire Saw Cutting Machine Tool

Flexibility and changeablility are the development trend of globalization of manufacturing industry.While reconfigurable manufacturing technology is an advanced manufacturing tech-nology which can respond to the market requirement quickly with full of high-frequency and unpredictable changes.It becomes the core competitiveness for enterprise that how to make use of the advanced manufacturing technology to relieve pressure effectively from the market of short cycle,low cost and customized and high quality.The core competitiveness of reconfigurable manufacturing system is the reconfiguration of the system or module.And Reconfigurable machine tool technology is a key technology to achieve this capability.This thesis considers the wire saw cutting machine,and analyzes the implementation of reconfigurable control system.Reconfigurable controller of machine tool is designed based on COM/DCOM technology.And the machine tool control systems is designed and developed based on requirement,machine reconstruction and real-time control.Real-time management to the processing of machine tools sy'stem is realized with system software debugging.The efficiency of the wire saw cutting machine is the focus of the brittle material cutting process.The model of material removal is established based on the analyzing the processes of cutting SiC monocrystalline wafer.Process parameters,such as the wire saw speed and workpiece feed rate,are analyzed to the impact on the cutting efficiency of processing.And generating process of the arc contacts of the workpiece and wire saws and its influence on cutting efficiency is analyzed.A cutting process optimization model is proposed based on dynamic programming theory.Discrete parameter is implemented for continuous optimization problems.The whole process is divided into different stages for optimization and analysis through discrete dynamic programming through.Such means as establishing different stages state equation and adjusting the process parameters dynamically to meet parameter optimization of SiC monocrystalline cutting process.