Preparation And Properties Of High-strength And High-pressure Epoxy Resin-based Composites

The rapid development of modern information technology and the electronics industry has led smart electronic devices into thousands of households.With the continuous development of smart electronic equipment in the direction of miniaturization,portability and multi-function,there are also higher requirements for packaging materials that connect semiconductors and electronic components.In the field of packaging materials,epoxy resin-based packaging materials account for more than 90%of the market due to their excellent comprehensive performance and low cost.In the field of packaging materials,epoxy resin-based packaging materials account for more than 90%of the market share due to their excellent comprehensive performance and low cost.At present,the main research and development of epoxy resin-based packaging materials mainly focus on the improvement of thermal conductivity and the reduction of thermal expansion coefficient.This article is based on the application of epoxy resin encapsulation materials in special fields such as aerospace and deep sea exploration.Using fillers and chopped fibers to synergistically reinforce the epoxy resin matrix,a high-strength,high-modulus,low-viscosity epoxy-based encapsulation material was developed.This packaging material fills the gap in the field of high-strength electronic packaging materials,the main research work is as follows:(1)The reinforcing effect of silica particle size and addition amount on epoxy resin matrix was explored,and the optimal filler addition amount(mass ratio resin:filler=100:160)and particle size(18?m)were obtained.The tensile strength of the resin matrix itself increased from 48.17±3.94MPa to 64.23±1.58MPa,an increase of 33.34%,the tensile modulus increased from 3.56±0.06GPa to 8.81±0.13GPa,an increase of 147.47%,and the compression strength from 154.731±1.84MPa increased to 222.13±1.72MPa,increased by 43.56%,pouring viscosity(80?)increased from 33.56mPa·s to 170.71mPa·s,and the microscopic toughening mechanism of inorganic particles was investigated by scanning electron microscopy.(2)Under the optimal filler particle size and addition amount,the length-to-diameter ratio of the chopped glass fiber and the addition amount on the reinforcement effect of the epoxy composite material were obtained,and the optimal epoxy composite material formula was obtained:100 copies Resin+160 parts of silicon fine powder(18?m)+60 parts of chopped glass fiber(1mm),at this time the filler and fiber have the best effect on improving the overall performance of the epoxy resin matrix,the tensile strength is 85.02±1.75MPa,an increase of 76.49%,the compressive strength is 215.99±2.63MPa,an increase of 39.59%,the tensile modulus is 10.57±0.14GPa,an increase of 196.91%,and the pouring viscosity(80?)is increased from 33.56mPa"s to 427.79mPa"s,while scanning The microscopic mechanism of filler/fiber synergistic reinforcement was investigated by electron microscope.(3)The effect of nano fillers and surface modification on the performance of filler/fiber synergistic composite materials was explored.When adding 1%(mass fraction)of nano silica,the performance of the composite materials was maximized,and the tensile strength of the composite materials The tensile strength was increased from 85.02±1.75MPa to 92.11±1.99MPa,an increase of 8.34%,the tensile modulus was increased from 10.57±0.14GPa to 11.26±0.07GPa,an increase of 6.5%,and the compression strength was increased from 215.99±2.63MPa to 234.26±2.67MPa,increased by 8.46%,pouring viscosity(80?)increased from 427.79mPa·s to 759.64mPa·s.(4)The effect of the addition of fillers and fibers on the thermodynamic properties of the composite material was explored.The addition of inorganic fillers and fibers will not affect the thermal decomposition process of the resin itself,but will absorb more energy during this process,resulting in thermal decomposition temperature rises.The addition of inorganic fillers and fibers will increase the glass transition temperature of the composite material,mainly because it hinders the movement of the resin molecule segments.(5)The performance of this formula was evaluated,and its processability at different temperatures and its bonding strength with metal materials(titanium alloy plates)were explored.The surface treatment of rigid metal materials was conducted to investigate the bonding The effect of intensity.The processing cycle of this formula at the pouring temperature of 80? can reach 66min.At the same time,the surface modification of the rigid material by the epoxy adhesive can effectively improve the tensile shear strength between the rigid material and the epoxy composite material,which is increased by 75.64%.