The Key Technology And Experimental Research Of PL Class Ultra-micro Sealing

Adhesive sealing technology is widely used in micro-assembly engineering.In recent years,with the rapid development of micro-electromechanical systems,micro-nano manufacturing,micro-electronic packaging,etc.,making the size of tiny parts smaller and smaller,and higher requirements are placed on the adhesive sealing technology during the micro-assembly process.It is of great significance to study the key technology of pL class ultra-micro adhesive sealing technology.The pL class ultra-micro adhesive sealing method and process are the key technologies for adhesive sealing.The paper studies the pL class transfer type ultra-micro micro-hole sealing method and time-pressure ultra-micro glue sealing method.The distribution mechanism of ultra-micro droplets,the spreading characteristics and the dynamic characteristics of the sealing process were analyzed.The microfluidic dynamics model of the adhesive sealing process was established.Through simulation research,the effects of tip diameter,micropore diameter,glue viscosity,return speed,insertion depth,feed pressure of the dispensing tube,and diameter of the dispensing tube on the sealing performance were analyzed.The mechanism of microbubble generation during the adhesive sealing process was studied,and the variation law of gas thin layer pressure during the adhesive sealing process was established.The sealing process and bonding process of micropores in micron and submicron sizes are discussed.Aiming at the difficulty of adhesive sealing in a narrow space,an integrated pL class transfer type ultra-micro dispensing pen was designed.Based on the above research,an experimental platform was built to verify the feasibility of the proposed adhesive sealing method and process.A large number of experiments and research results show that: The pL class transfer type ultra-micro sealing method can realize micropore sealing in a narrow space.When the micropore diameter is less than 10 ?m,the micropore sealing is realized by the cover type,the surface diameter of the glue spot can be as small as 24 ?m at a pore diameter of about 5 ?m,and the dispensing amount is about 4 pL;when the micropore diameter is larger than 10 ?m,the micropore sealing is realized by a plug-in type.According to the size of the micropore,the adhesive sealing process can be reasonably selected,matching the diameter of the needle tip,the viscosity of the glue,the return speed and other parameters can be used to uniformly seal the micropores in different diameter ranges.Micro component bonding can be achieved by time-pressure ultra-micro glue sealing method,and the surface sealing glue spot can reach10 pL.By controlling the pipe diameter and the viscosity of the glue,the bonding strength andsealing performance can be effectively guaranteed.