The Reliability Design And Optimization Of SoC Final Test

The integration of SoC becomes more and more high,the function becomes more and more complex,thus the difficulty of the final test is on the increase.Final testing of SoC is faced with several problems: improve product yield;improve test reliability,rapid introduce new SoC products for seize the market,ATE performance improvement;reduce test cost.Every drop one percent yield of the SoC product,it will directly cause millions of dollars in losses.Fail product send to our customer,it will cause customer loss directly then customer will complain to us and even lose customer.So the yield and test reliability is the most important in the final test.This thesis is based on practical application,research and analysis low yield caused by O/S test fail,the reason of SoC mass production low yield,the method of improve the reliability of SoC test.Using oriented large-scale SoC test platform ADVANTEST T6575,applying leading ADVANTEST SoC test technology.Base on software and hardware,this thesis provide solutions in order to improve SoC product yield and test reliability,reduce test cost.Through experiment to verify solutions.This thesis summarizes the method to improve yield and reliability of SoC test.Introduced the optimize of the SoCket pogo pin design and using new coating of pogo pin in improving the O/S test yield.Introduced the method to find the cause of low yield in mass production.Introduced the way to increase the test coverage in improving test reliability.The solution result proved the new methods can improve production yield to achieve expected yield,contributed to company production and quality.