| Recent microelectronic devices and microelectromechanical systems (MEMS) introduce a number of packaging issues that are distinct and different from conventional electronic packaging as devices are becoming problematic. In addition, the packaging or encapsulation materials are often exposed to harsh environments where their performance can be drastically degraded. The use of polymers has been increasing in packaging applications, including substrates, adhesives, encapsulants, and overmolds of the components. Often the surface of these polymers needs to be effectively protected as they are not mechanically robust and may not possess sufficient hermetic protection.; The use of surface coatings on the polymer packages broadens their applications by providing a cost-effective solution for the protection of critical components. Elastomeric polydimethylsiloxane (PDMS) is a good candidate material for surface coatings or encapsulations. (Abstract shortened by UMI.)... |
